MT48LC16M16A2BG-7E:D

The MT48LC16M16A2BG-7E:D is a 256 Mbit SDR SDRAM organized as 16M × 16 with a parallel memory interface in a 54-ball VFBGA package (8 × 14 mm). It implements fully synchronous SDRAM architecture with internal pipelining and multiple banks to support high-throughput, burst-oriented memory operations.

This device is targeted at systems requiring PC100/PC133‑class parallel SDRAM capacity and timing (133 MHz clock frequency), offering standard SDRAM features such as programmable burst lengths, auto refresh and self‑refresh modes for system memory applications where a compact BGA footprint and 3.3 V supply are required.

Key Features

• Core / Architecture  4 Meg × 16 × 4 banks organization (16M × 16 total), fully synchronous SDRAM with internal pipelining and registered signals on the positive clock edge.
• Performance / Timing  PC100- and PC133-compliant operation with a 133 MHz clock frequency, specified access time of 5.4 ns and word/page write cycle time of 14 ns.
• Burst and Refresh  Programmable burst lengths (1, 2, 4, 8 or full page), auto precharge, auto refresh and self‑refresh support as described in the device family features.
• Power  Single‑supply operation at 3.0 V to 3.6 V for standard 3.3 V systems.
• Package  54‑ball VFBGA package (54‑VFBGA, 8 × 14 mm) that provides a compact board footprint for high‑density mounting.
• Operating Range  Commercial operating temperature range of 0°C to +70°C (TA).
• Standards and Compatibility  LVTTL‑compatible inputs/outputs and compliance with PC100/PC133 timing classes as documented in the product family datasheet.

Typical Applications

• PC100/PC133 memory subsystems  Use as a parallel SDRAM device in systems designed to PC100/PC133 timing classes that require 256 Mbit capacity.
• Board‑level memory expansion  Compact 54‑VFBGA package for high‑density board designs where a parallel SDRAM component is needed.
• Embedded system memory  Standard SDRAM features (burst modes, auto refresh, self‑refresh) suitable for embedded applications requiring a 3.3 V parallel SDRAM interface.

Unique Advantages

• Standard PC100/PC133 compliance: Enables integration into systems designed around PC100 and PC133 timing classes with defined 133 MHz operation.
• Flexible burst and refresh modes: Programmable burst lengths plus auto and self‑refresh options simplify memory management and support different access patterns.
• Compact BGA footprint: 54‑ball VFBGA (8 × 14 mm) reduces board area for high‑density designs while providing a parallel SDRAM interface.
• Wide supply tolerance: Operates from 3.0 V to 3.6 V, matching common 3.3 V system supplies.
• Commercial temperature rating: Specified for 0°C to +70°C (TA), suitable for standard commercial electronics environments.

Why Choose IC DRAM 256MBIT PAR 54VFBGA?

The MT48LC16M16A2BG-7E:D delivers a compact, parallel SDRAM solution with 256 Mbit density, PC100/PC133‑class timing and standard SDRAM features such as programmable burst lengths, auto precharge and refresh modes. Its 54‑ball VFBGA package and 3.0–3.6 V supply make it suitable for board‑level implementations where space and compatibility with 3.3 V systems are considerations.

This device is appropriate for engineers specifying parallel SDRAM in commercial temperature environments who require documented timing (133 MHz clock), standard refresh behavior and a proven SDRAM feature set as described in the product family datasheet.

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