MT48LC16M16A2P-6A XIT:G TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,132 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT48LC16M16A2P-6A XIT:G TR – IC DRAM 256MBIT PAR 54TSOP II
The MT48LC16M16A2P-6A XIT:G TR is a 256 Mbit synchronous DRAM device organized as 16M × 16 with a parallel memory interface. It implements SDR SDRAM architecture with fully synchronous, pipelined operation suitable for systems requiring a 3.3 V single-supply parallel DRAM.
Targeted at designs that require PC100/PC133-class synchronous DRAM behavior and industrial temperature operation, this device provides programmable burst lengths, internal bank management, and standard SDRAM refresh modes for reliable data storage in board-level memory subsystems.
Key Features
- Memory Core 256 Mbit SDRAM organized as 16M × 16 with 4 internal banks for hidden row access and precharge.
- Synchronous, Pipelined Operation Fully synchronous design with all signals registered on the positive edge of the system clock and internal pipelining to allow column address changes every clock cycle.
- Speed and Timing Clock frequency up to 167 MHz (speed grade -6A) and specified access performance (access time 5.4 ns; write cycle time word/page 12 ns).
- Programmable Burst and Refresh Programmable burst lengths (1, 2, 4, 8, or full page) with auto precharge, auto refresh and self refresh modes; supports 8192-cycle refresh.
- Voltage and I/O Single-supply operation at 3.0 V to 3.6 V with LVTTL-compatible inputs and outputs per the datasheet feature set.
- Package and Temperature 54-pin TSOP II (0.400", 10.16 mm width) in a 54-TSOP (0.400") package; operating temperature range −40 °C to +85 °C (TA).
Typical Applications
- PC100/PC133-class computing platforms Used as parallel SDRAM memory in systems requiring synchronous DRAM timing and burst access behavior.
- Industrial controllers and equipment Industrial-temperature operation (−40 °C to +85 °C) supports deployment on board-level memory subsystems in industrial applications.
- Board-level memory expansion 54-pin TSOP II package enables integration where parallel DRAM density and standard TSOP footprint are required.
Unique Advantages
- Synchronous, predictable timing: Fully synchronous operation and registered inputs ensure repeatable timing behavior for system design and verification.
- Flexible burst control: Programmable burst lengths (1, 2, 4, 8 or full page) deliver adaptable data transfer patterns for different access profiles.
- Robust refresh management: Auto refresh and self refresh modes plus 8192 refresh cycles support data retention without external intervention.
- Industry temperature support: −40 °C to +85 °C operating range suits applications requiring extended temperature performance.
- Standard 3.3 V single-supply: Operates from 3.0 V to 3.6 V, simplifying power rail requirements on legacy and contemporary boards.
- Compact TSOP II package: 54-pin TSOP II footprint provides a board-level package option for parallel SDRAM integration.
Why Choose MT48LC16M16A2P-6A XIT:G TR?
The MT48LC16M16A2P-6A XIT:G TR delivers a 256 Mbit parallel SDRAM solution with synchronous, pipelined operation and PC100/PC133-class timing, packaged in a 54-pin TSOP II. Its feature set — including programmable burst lengths, internal banks, and standard refresh modes — makes it suited for board-level memory subsystems that require deterministic timing and industrial temperature operation.
This device is appropriate for engineers specifying a 3.3 V parallel SDRAM with 16M × 16 organization, especially where a TSOP II footprint and extended temperature range are required. Its standard SDRAM feature set supports straightforward integration into systems that depend on synchronous DRAM behavior and reliable refresh management.
Request a quote or submit an inquiry for pricing and availability of the MT48LC16M16A2P-6A XIT:G TR to receive detailed lead-time and procurement information.