MT48LC16M16A2P-6A:D

The MT48LC16M16A2P-6A:D is a 256 Mbit SDRAM organized as 16M × 16 with a parallel memory interface in a 54-pin TSOP II (400 mil, 10.16 mm width) package. It implements fully synchronous SDR SDRAM architecture with internal pipelined operation and four internal banks, suitable for systems requiring high-throughput parallel DRAM in a compact TSOP footprint.

Targeted for commercial temperature applications, this device supports a 3.3 V ±0.3 V power supply (3.0–3.6 V), a 167 MHz clock frequency (–6A speed grade), and timing optimized for a 3-3-3 RCD-RP-CL profile.

Key Features

• Memory Core 256 Mbit SDRAM organized as 16M × 16 with four internal banks for improved row/column access concurrency.
• Performance –6A speed grade rated for 167 MHz clock frequency with a 3-3-3 timing profile (RCD-RP-CL) and an access time of 5.4 ns.
• SDR SDRAM Functionality Fully synchronous operation with internal pipelining; column address can be changed every clock cycle and programmable burst lengths of 1, 2, 4, 8, or full page.
• Refresh and Power Modes Auto refresh and self-refresh modes supported, with 64 ms / 8192-cycle refresh for commercial devices; write recovery and auto precharge options present.
• Interface and I/O Parallel SDRAM interface with LVTTL-compatible inputs and outputs for standard logic-level connectivity.
• Electrical Single 3.3 V ±0.3 V power supply (3.0–3.6 V) and typical write cycle time (word page) of 12 ns.
• Package and Temperature 54-pin TSOP II (400 mil, 10.16 mm width) plastic package; commercial operating temperature range 0°C to 70°C (TA).

Typical Applications

• Commercial embedded systems — Parallel SDRAM for general-purpose memory in control and interface boards operating at commercial temperatures.
• PC and computing modules — Suitable for designs requiring PC100/PC133-compliant SDRAM timing and parallel memory architectures.
• Compact board-level memory — Use where a 54-pin TSOP II package and 256 Mbit density meet footprint and density constraints.

Unique Advantages

• High-frequency operation: 167 MHz (–6A) speed grade enables lower-cycle latencies with a 3-3-3 timing target and 5.4 ns access time.
• Flexible burst and bank management: Programmable burst lengths and four internal banks allow efficient handling of sequential and random access patterns.
• Standard voltage compatibility: Single 3.3 V ±0.3 V supply simplifies power rail design in systems using 3.3 V logic.
• Compact TSOP II package: 54-pin 400 mil TSOP II footprint (10.16 mm width) provides a space-efficient solution for board-level memory integration.
• Built-in refresh and low-power modes: Auto refresh and self-refresh support reduce external refresh management and help sustain data integrity.
• LVTTL I/O: Logic-level compatible inputs/outputs simplify interface to common system controllers and memory buses.

Why Choose MT48LC16M16A2P-6A:D?

The MT48LC16M16A2P-6A:D delivers a practical combination of 256 Mbit density, 16M × 16 organization and 167 MHz SDRAM performance in a compact 54-pin TSOP II package for commercial-temperature systems. Its synchronous, pipelined architecture with programmable burst lengths and internal banks supports efficient memory throughput in parallel-interface designs.

This device is well suited to designers needing a verified SDRAM implementation with standard 3.3 V supply operation, LVTTL I/O, and integrated refresh/self-refresh capabilities, offering predictable timing and a compact form factor for board-level memory solutions.

If you would like pricing information or a formal quote for MT48LC16M16A2P-6A:D, please submit a request for a quote or a parts inquiry and our team will respond with availability and lead-time details.