MT48LC16M16A2P-7E:G TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 89 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC16M16A2P-7E:G TR – IC DRAM 256MBIT PAR 54TSOP II

The MT48LC16M16A2P-7E:G TR is a 256 Mbit synchronous DRAM organized as 16M × 16 with four internal banks and a parallel memory interface. It is a PC100/PC133-compliant SDR SDRAM device designed for systems requiring fully synchronous, pipelined DRAM operation.

Key attributes include a 133 MHz clock rating (speed grade -7E), single 3.3 V ±0.3 V supply operation, and a commercial operating temperature range of 0°C to 70°C—suited for PC-class and legacy parallel SDRAM applications.

Key Features

  • Core / Architecture  Fully synchronous SDR SDRAM with internal pipelined operation and four internal banks to hide row access/precharge latency.
  • Memory Organization  256 Mbit capacity organized as 16M × 16 with 4 banks, providing parallel word-wide data paths for system memory implementations.
  • Performance / Timing  PC100- and PC133-compliant; speed grade -7E targets 133 MHz with 2-2-2 RCD-RP-CL timing (CL = 2). Access time listed at 5.4 ns and write cycle time (word/page) of 14 ns.
  • Programmable Transfer Modes  Supports programmable burst lengths (1, 2, 4, 8 or full page) and internal column address changes every clock cycle for burst-oriented transfers.
  • Refresh & Power Modes  Auto refresh and auto precharge modes plus self-refresh capability (note: self-refresh availability varies by device option) to maintain data integrity across refresh cycles.
  • Voltage & I/O  Single 3.3 V ±0.3 V power supply (listed voltage range 3.0 V to 3.6 V) with LVTTL-compatible inputs and outputs.
  • Package  54-pin TSOP II (400 mil / 10.16 mm width) plastic package optimized for surface-mount assembly.
  • Operating Range  Commercial temperature grade with operating temperature 0°C to 70°C.

Typical Applications

  • PC-Class and Legacy Systems  Parallel SDRAM memory for PC100/PC133-class motherboards and legacy computing platforms that use x16 SDRAM configurations.
  • Embedded Systems  System memory in embedded designs that require a parallel SDRAM interface and 3.3 V single-supply operation.
  • Consumer Electronics  Memory subsystem for consumer devices operating within the 0°C to 70°C commercial temperature range.

Unique Advantages

  • PC100/PC133 Compliance: Ensures compatibility with systems designed to PC100 and PC133 timing and frequency targets.
  • Fully Synchronous, Pipelined Operation: Allows column addresses to be changed every clock cycle and supports burst transfers for efficient data throughput.
  • Flexible Burst and Precharge Options: Programmable burst lengths and auto precharge/auto refresh modes simplify memory controller design and sequencing.
  • Single-Supply Simplicity: Operates from a single 3.3 V ±0.3 V supply (3.0 V–3.6 V), reducing power-rail complexity in system designs.
  • Compact Surface-Mount Package: 54-pin TSOP II (400 mil) package provides a standardized, solderable footprint for board-level assembly.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The MT48LC16M16A2P-7E:G TR offers a straightforward, standards-aligned parallel SDRAM solution for designs that require a 256 Mbit x16 memory with PC100/PC133 interoperability, pipelined operation, and flexible burst handling. Its single 3.3 V supply and 54-pin TSOP II package make it suitable for compact, surface-mount system memory implementations within commercial temperature environments.

This device is well suited to engineers and procurement teams maintaining or developing systems that depend on legacy parallel SDRAM interfaces and PC100/PC133 timing. The combination of synchronous operation, programmable transfer modes, and standard packaging supports predictable integration and long-term design stability.

Request a quote or submit an availability inquiry to receive pricing and lead-time information for the MT48LC16M16A2P-7E:G TR.

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