MT48LC2M32B2B5-6A:J

IC DRAM 64MBIT PAR 90VFBGA
Part Description

IC DRAM 64MBIT PAR 90VFBGA

Quantity 145 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-VFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging90-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC2M32B2B5-6A:J – IC DRAM 64MBIT PAR 90VFBGA

The MT48LC2M32B2B5-6A:J is a 64 Mbit SDR SDRAM organized as 2M x 32 with a parallel memory interface in a 90-ball VFBGA package. It implements fully synchronous SDRAM architecture with internal pipelining and banked operation to support high-throughput burst access patterns for commercial embedded systems.

Designed for commercial-temperature applications (0°C to +70°C) and single-supply operation around 3.3 V, this device targets systems requiring compact, parallel SDRAM memory with PC100-compliant timing and programmable burst lengths.

Key Features

  • Memory Architecture — 64 Mbit SDRAM organized as 2M × 32 with 4 internal banks; supports parallel interface operation and standard DRAM memory format.
  • Synchronous SDRAM Operation — Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelined operation for column-address changes every clock cycle.
  • Performance Grades — Speed grade -6A targets a 167 MHz clock frequency; documented timing includes an access time of 5.4 ns and a write cycle time (word page) of 12 ns.
  • Programmable Burst and Latency — Programmable burst lengths (1, 2, 4, 8, or full page) and support for CAS latency values of 1, 2, and 3 to match system timing requirements.
  • Refresh and Power Management — Supports auto refresh and self refresh modes; 4096-cycle refresh and options for 64 ms/4096-cycle refresh (commercial) as described in the datasheet.
  • Voltage and I/O — Single-supply operation at 3.3 V ±0.3 V (listed supply 3.0 V to 3.6 V) with LVTTL-compatible inputs and outputs.
  • Compact Package — 90-ball VFBGA (8 mm × 13 mm) package suitable for space-constrained designs.
  • Commercial Temperature Range — Rated for operation from 0°C to +70°C (TA).

Typical Applications

  • Commercial Embedded Systems — Parallel SDRAM for general-purpose embedded memory in consumer and commercial electronics operating within 0°C to +70°C.
  • PC100-Compatible Designs — Systems requiring PC100-compliant SDRAM timing and synchronous operation.
  • Buffering and Frame Storage — Burst-capable SDRAM suitable for data buffering and short-term frame or packet storage where parallel memory access is required.

Unique Advantages

  • Deterministic Synchronous Operation: All signals registered on the positive edge of the clock and internal pipelining enable predictable timing for system design.
  • Flexible Burst Control: Programmable burst lengths and CAS latency support enable tuning of throughput and latency to match application needs.
  • High-Density x32 Organization: 2M × 32 organization delivers 64 Mbit in a single compact device, reducing board area for parallel memory implementations.
  • Standard Voltage Range: Single 3.3 V supply with tolerance 3.0 V–3.6 V simplifies power sequencing in legacy and contemporary 3.3 V systems.
  • Space-Saving VFBGA Package: 90-ball VFBGA (8×13 mm) provides a small footprint for designs with board space constraints.
  • Refresh and Low-Power Modes: Auto refresh and self-refresh support help manage data retention and power during idle periods as specified in the datasheet.

Why Choose MT48LC2M32B2B5-6A:J?

The MT48LC2M32B2B5-6A:J combines proven SDR SDRAM architecture with a compact VFBGA package and PC100-compatible timing to meet the needs of commercial embedded designs that require synchronous, parallel memory. Its 2M × 32 organization, programmable burst lengths, and multiple CAS latencies provide designers with flexible options for tuning performance and latency.

This device is suited for designers seeking a verifiable, commercially rated SDRAM solution for buffering, frame storage, and general-purpose embedded memory where a 3.3 V supply and a 0°C to +70°C operating range are acceptable. The documented timing and refresh features give engineers the data needed for reliable system integration and long-term deployment.

Request a quote or contact sales for pricing, lead times, and availability for the MT48LC2M32B2B5-6A:J. Provide your requirements to receive a tailored response on supply and support options.

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