MT48LC2M32B2B5-7 IT:G TR

The MT48LC2M32B2B5-7 IT:G TR is a 64 Mbit (2M × 32) SDR SDRAM device delivered in a 90-ball VFBGA (8 mm × 13 mm) package. It provides a synchronous parallel DRAM interface with internal pipelined operation and banked architecture for predictable, clocked memory access.

This device is suited for designs that require 64 Mbit parallel SDRAM operating from a 3.0 V to 3.6 V supply and supporting an operating temperature range of −40°C to +85°C. Its documented timing and refresh options support configurable burst lengths and CAS latencies for system memory applications needing deterministic SDRAM behavior.

Key Features

• SDR SDRAM Core  Fully synchronous SDRAM with registered inputs on the positive edge of the system clock.
• Memory Organization  2M × 32 organization (512K × 32 × 4 banks) providing 64 Mbit capacity with internal banks to hide row access and precharge latency.
• Performance Grades  Specified for a 143 MHz clock frequency (speed grade -7) with an access time of 5.5 ns and a write cycle time (word/page) of 14 ns.
• Programmable Burst & Latency  Supports programmable burst lengths (1, 2, 4, 8, or full page) and CAS latencies of 1, 2, and 3 to match system timing requirements.
• Power  Single-supply operation at 3.3 V ±0.3 V (nominal range 3.0 V to 3.6 V).
• Refresh & Power Management  Auto refresh and self-refresh modes with 4096-cycle refresh support; 64 ms/4096-cycle refresh supported for the listed temperature ranges.
• Package  90-ball VFBGA package (8 mm × 13 mm) for compact, high-density board-level implementation.
• Operating Temperature  Specified operating ambient range of −40°C to +85°C (TA).

Typical Applications

• Parallel SDRAM system memory  Used where a 64 Mbit ×32 parallel SDRAM interface is required for predictable, synchronous memory access.
• Board-level memory integration  Compact 90-ball VFBGA packaging for dense PCB layouts where space-constrained DRAM is needed.
• Industrial-temperature designs  Components and systems that must operate across −40°C to +85°C ambient conditions.

Unique Advantages

• Banked, pipelined architecture: Internal banks and pipelined operation allow column addresses to be changed every clock cycle to improve effective throughput for burst accesses.
• Flexible timing configuration: Programmable burst lengths and support for CAS latencies (1, 2, 3) let designers tune performance to match system timing and bus characteristics.
• Compact VFBGA package: 90-ball VFBGA (8 mm × 13 mm) enables high-density placement on modern PCBs while providing the full 32-bit data width.
• Wide operating voltage window: 3.0 V to 3.6 V supply range accommodates typical 3.3 V system rails with tolerance for supply variation.
• Industrial temperature support: Specified −40°C to +85°C ambient operation addresses applications with extended temperature requirements.

Why Choose MT48LC2M32B2B5-7 IT:G TR?

The MT48LC2M32B2B5-7 IT:G TR delivers a compact, fully synchronous 64 Mbit SDRAM solution with configurable burst lengths and CAS latencies, a banked architecture for improved access efficiency, and a 90-ball VFBGA footprint for dense board designs. Its 3.0 V–3.6 V supply range and −40°C to +85°C operating window make it suitable for systems requiring reliable parallel SDRAM memory in temperature-challenged environments.

This part is intended for designers who need a predictable, parallel SDRAM device with flexible timing and compact packaging for board-level memory integration. The combination of programmable timing, internal banking, and industrial-temperature rating provides a practical balance of performance and system-level adaptability.

Request a quote or submit an RFQ for the MT48LC2M32B2B5-7 IT:G TR to discuss availability, lead times, and volume pricing for your next design.