MT48LC2M32B2P-5:G

The MT48LC2M32B2P-5:G is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface in an 86-pin TSOP II package. It implements a fully synchronous SDRAM architecture with internal banks and pipelined operation for predictable, clocked memory access.

Designed for commercial-temperature applications (0°C to 70°C), the device targets systems requiring PC100-class SDRAM behavior with a 200 MHz clock option, flexible burst lengths and selectable CAS latency settings.

Key Features

• SDR SDRAM Architecture Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelined operation for column-address changes every cycle.
• Memory Organization & Density 2M × 32 configuration (512K × 32 × 4 banks) delivering 64 Mbit of DRAM in a single package.
• Timing & Performance 200 MHz clock frequency (–5 speed grade) with access timing examples including 4.5 ns access time and support for CAS latencies (CL) of 1, 2 and 3; programmable burst lengths of 1, 2, 4, 8 or full page.
• Refresh & Power Modes Auto refresh and self-refresh support (self-refresh not available on AT devices), with 4K refresh cycles and standard refresh intervals as defined in the device documentation.
• Interface & I/O Parallel memory interface with LVTTL-compatible inputs and outputs for standard 3.3 V signaling.
• Supply & Temperature Single 3.3 V ±0.3 V supply range (3.0 V to 3.6 V) and commercial operating temperature range of 0°C to 70°C.
• Package 86-pin TSOP II (400 mil / 10.16 mm width) standard package for compact board integration.

Typical Applications

• PC100-class systems — Memory subsystem implementations and legacy platforms requiring PC100-compliant SDRAM timing and behavior.
• Embedded systems — Local DRAM for embedded controllers and modules that require a 64 Mbit parallel SDRAM with 3.3 V operation.
• Consumer electronics — Buffer and working memory in consumer devices designed to operate within the commercial temperature range and standard 86-TSOP II footprint.

Unique Advantages

• PC100 timing compatibility: Offers a 200 MHz (–5) speed grade option and timing parameters aligned with PC100-class SDRAM requirements for predictable system integration.
• Flexible latency and burst control: Programmable CAS latencies (1–3) and burst lengths (1, 2, 4, 8, full page) let designers tune access patterns for application needs.
• Compact, industry-standard packaging: 86-pin TSOP II package simplifies board layout for designs constrained by PCB area while maintaining standard pinout conventions.
• Standard 3.3 V operation: 3.0 V to 3.6 V supply range ensures compatibility with common 3.3 V system power rails.
• Banked, pipelined architecture: Internal banks and pipelined operation help hide row access/precharge overhead and support efficient, continuous column accesses.

Why Choose IC DRAM 64MBIT PAR 86TSOP II?

The MT48LC2M32B2P-5:G provides a compact, commercially rated SDR SDRAM option that combines standard 86-TSOP II packaging with PC100-class timing and flexible latency/burst controls. It is suitable for designs that require a 64 Mbit parallel SDRAM device operating from a 3.3 V supply within a 0°C to 70°C range.

Choose this device for system-level designs that need an established SDRAM feature set—programmable burst lengths, multiple CAS latencies, internal banking and standard electrical interfaces—delivered in a footprint compatible with common board layouts.

Request a quote or submit a pricing inquiry for MT48LC2M32B2P-5:G to evaluate integration into your next design or to obtain production and availability information.