MT48LC32M16A2P-75:C TR

The MT48LC32M16A2P-75:C TR is a 512 Mbit synchronous DRAM (SDRAM) device organized as 32M × 16 with a parallel memory interface. It implements a fully synchronous, pipelined architecture with internal banks and programmable burst lengths to support high-throughput memory operations.

Designed for systems requiring PC100/PC133-compliant SDRAM operation, this part provides 133 MHz clock operation with low access latency, standard 54-pin TSOP II packaging, and a single 3.3 V-class power supply for board-level memory expansion.

Key Features

• Memory Architecture  512 Mbit SDRAM organized as 32M × 16 with internal bank structure (4 banks) to improve access concurrency and throughput.
• SDR SDRAM Compliance  PC100- and PC133-compliant device with fully synchronous operation and all signals registered on the positive edge of the system clock.
• Performance & Timing  Clock frequency up to 133 MHz with an access time of 5.4 ns (CL = 3, -75 speed grade) and a write cycle time (word/page) of 15 ns for predictable timing behavior.
• Programmable Burst & Internal Pipelining  Supports programmable burst lengths (1, 2, 4, 8, or full page) and internal pipelined operation allowing column address changes every clock cycle.
• Refresh & Power Modes  Auto refresh and self-refresh modes supported with a 64 ms, 8192-cycle refresh scheme; single 3.3 V ±0.3 V supply (listed as 3.0 V to 3.6 V).
• I/O Compatibility  LVTTL-compatible inputs and outputs for standard logic-level interfacing.
• Package & Mounting  54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount board integration; commercial operating temperature range 0°C to 70°C (TA).

Typical Applications

• PC100/PC133 memory subsystems  Use as system DRAM in platforms targeting PC100 or PC133 SDRAM compatibility.
• Board-level memory expansion  54-pin TSOP II package enables addition of parallel SDRAM where a 3.3 V single-supply memory is required.
• Embedded systems with parallel SDRAM interface  Parallel memory interface and LVTTL I/Os make the device suitable for embedded designs requiring synchronous DRAM storage.

Unique Advantages

• Low access latency: With a specified access time of 5.4 ns (CL = 3 at 133 MHz), the device delivers quick data access for time-sensitive memory operations.
• Standard SDRAM timing compatibility: PC100/PC133 compliance simplifies integration into existing SDRAM-based designs.
• Flexible burst operation: Programmable burst lengths and internal pipelining allow designers to optimize throughput for sequential and random access patterns.
• Single-supply operation: Operates from a 3.0 V to 3.6 V supply, matching common 3.3 V system power rails.
• Board-friendly package: 54-pin TSOP II (400 mil) packaging supports compact surface-mount implementations.
• Commercial temperature range: Rated for 0°C to 70°C (TA) for use in standard commercial environments.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The MT48LC32M16A2P-75:C TR offers a straightforward SDRAM solution when you need 512 Mbit of parallel synchronous memory with PC100/PC133 timing compatibility, low access latency, and programmable burst operation. Its 54-pin TSOP II package and single 3.3 V-class supply make it suitable for board-level memory expansion in commercial systems and embedded designs.

Manufactured by Micron Technology, the device combines standard SDRAM features—internal banks, auto-refresh/self-refresh modes, and LVTTL I/Os—to provide predictable performance and integration ease for engineers specifying parallel SDRAM in new or legacy platforms.

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