MT48LC32M8A2BB-6A:G TR

IC DRAM 256MBIT PAR 60FBGA
Part Description

IC DRAM 256MBIT PAR 60FBGA

Quantity 1,525 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x16)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging60-FBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC32M8A2BB-6A:G TR – IC DRAM 256MBIT PAR 60FBGA

The MT48LC32M8A2BB-6A:G TR is a 256 Mbit SDRAM organized as 32M × 8 with a parallel interface in a 60-ball FBGA (8 × 16) package. It is a fully synchronous SDRAM device designed for commercial-temperature applications with a single 3.3 V ±0.3 V power supply.

Targeted for systems requiring standard SDRAM functionality, this device offers internal pipelined operation, multiple programmable burst lengths, and built-in refresh and self-refresh modes. Key attributes include a 167 MHz clock frequency (speed grade -6A), a 5.4 ns access time specification, and commercial operating range of 0 °C to 70 °C.

Key Features

  • Core / Architecture  Fully synchronous SDR SDRAM with all signals registered on the positive edge of the system clock and internal pipelined operation for predictable timing.
  • Memory Organization  256 Mbit capacity configured as 32M × 8 with 4 internal banks (8 Meg × 8 × 4 banks as listed in datasheet).
  • Performance & Timing  Clock frequency up to 167 MHz (speed grade -6A) with target RCD–RP–CL = 3–3–3 for the -6A grade; specified access time 5.4 ns and a 12 ns write cycle time (word/page).
  • Burst & Refresh  Programmable burst lengths (1, 2, 4, 8, or full page) plus auto precharge and auto refresh; includes self-refresh mode (per datasheet feature set).
  • Power  Single power supply: 3.0 V to 3.6 V (3.3 V ±0.3 V), matching the device's standard SDRAM power requirements.
  • Package & Thermal  60-ball FBGA (8 mm × 16 mm) package in a compact footprint; commercial ambient operating temperature range of 0 °C to 70 °C (TA).
  • Interface  Parallel SDRAM interface with LVTTL-compatible inputs/outputs as noted in the device feature set.

Unique Advantages

  • Standard SDRAM compatibility: Uses fully synchronous SDR architecture and documented PC100/PC133 compliance options, enabling integration into established system designs that use standard SDRAM timing models.
  • Flexible burst control: Programmable burst lengths (1, 2, 4, 8, or full page) allow tuning for sequential or random access patterns to optimize throughput.
  • Compact FBGA package: 60-ball FBGA (8 × 16 mm) provides a small board footprint while retaining parallel SDRAM pinout for dense system layouts.
  • Commercial temperature performance: Rated for 0 °C to 70 °C operation, suitable for a wide range of non-automotive, commercial electronic applications.
  • Robust refresh and low-power modes: Auto refresh and self-refresh capabilities reduce external refresh management and support lower-power standby modes where applicable.

Why Choose MT48LC32M8A2BB-6A:G TR?

The MT48LC32M8A2BB-6A:G TR delivers a straightforward, standards-based SDRAM solution with a 256 Mbit capacity in a compact 60-ball FBGA package. Its documented timing grades, programmable burst lengths, and internal banking provide designers with predictable performance and efficient memory access patterns for commercial systems operating at 3.3 V.

This device is well suited to designs that require a parallel SDRAM memory with documented clock/timing behavior and refresh management, offering a balance of density, timing flexibility, and a compact package for space-constrained boards.

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