MT48LC32M8A2BB-75:D

The MT48LC32M8A2BB-75:D is a 256 Mbit SDR SDRAM device organized as 32M × 8 with a parallel memory interface in a 60-ball FBGA (8 mm × 16 mm) package. It implements fully synchronous, pipelined SDRAM architecture and is offered in the -75 speed grade (133 MHz).

Designed for systems requiring PC100/PC133-compliant SDR SDRAM behavior, the device provides programmable burst lengths, internal bank architecture, and standard SDRAM timing options to support synchronous memory subsystems in commercial-temperature applications.

Key Features

• Core / Memory Architecture  256 Mbit SDRAM organized as 32M × 8 with four internal banks; fully synchronous operation with all signals registered on the positive edge of the system clock.
• Performance & Timing  133 MHz clock frequency (−75 speed grade); specified access time 5.4 ns and write cycle time (word/page) 15 ns; datasheet timing target for −75 is 3‑3‑3 (RCD‑RP‑CL).
• SDR SDRAM Functionality  PC100- and PC133-compliant; internal pipelined operation with column address changes allowed every clock cycle; programmable burst lengths of 1, 2, 4, 8, or full page; auto precharge and auto refresh supported; self refresh mode available (note: not available on AT devices per datasheet).
• Power  Single-supply operation at 3.3 V nominal (3.0 V to 3.6 V specified).
• Package & Mounting  60-ball FBGA (8 × 16 mm) mounting; supplier device package listed as 60-FBGA (8×16).
• Operating Temperature  Commercial temperature range: 0°C to +70°C (TA).
• Revision  Supplied with revision D designation (part suffix :D) as indicated in the part numbering information.

Typical Applications

• PC100/PC133 Synchronous Memory Subsystems  Acts as a 256 Mb SDRAM component where PC100/PC133-compliant SDR SDRAM timing and behavior are required.
• Board-Level DRAM for FBGA Designs  Provides parallel SDRAM storage in designs that accept a 60-ball FBGA (8×16) package footprint.
• Synchronous, Pipelined Memory Architectures  Supports systems that leverage fully synchronous, pipelined SDRAM operation with programmable burst lengths and internal bank management.

Unique Advantages

• Standards Compatibility: PC100 and PC133 compliance listed in the datasheet simplifies timing alignment with systems targeting those SDRAM standards.
• Predictable, Synchronous Operation: Positive-edge registering of all signals and pipelined internal operation enable consistent, clocked memory behavior as documented in the datasheet.
• Flexible Access Patterns: Programmable burst lengths (1, 2, 4, 8, full page) and internal banks help accommodate varied read/write access patterns.
• Compact FBGA Footprint: 60-ball FBGA (8 mm × 16 mm) package minimizes board area for high-density layouts.
• Commercial Temperature Rating: Specified for 0°C to +70°C operation for commercial applications.

Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?

The MT48LC32M8A2BB-75:D delivers a standardized 256 Mbit SDRAM building block with PC100/PC133-compliant timing, fully synchronous pipelined operation, and flexible burst modes—making it suitable for designs needing predictable, clocked DRAM behavior in a compact FBGA package. Key electrical and timing specifications (3.0–3.6 V supply, 133 MHz clock, 5.4 ns access time, 15 ns write cycle) are provided to aid integration and system timing analysis.

This device is appropriate for commercial-temperature systems requiring a 32M × 8 SDRAM configuration in a 60-ball FBGA form factor, and benefits designers looking for a documented Micron 256Mb SDR SDRAM solution with revision D part identification.

Request a quote or submit an RFQ to obtain pricing, lead-time, and availability information for the MT48LC32M8A2BB-75:D.