MT48LC32M8A2FB-75:D TR

IC DRAM 256MBIT PARALLEL 60FBGA
Part Description

IC DRAM 256MBIT PARALLEL 60FBGA

Quantity 1,259 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x16)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-FBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC32M8A2FB-75:D TR – IC DRAM 256MBIT PARALLEL 60FBGA

The MT48LC32M8A2FB-75:D TR is a 256 Mbit synchronous DRAM organized as 32M × 8 and provided in a 60-ball FBGA package (8 × 16). It implements SDR SDRAM architecture with a parallel memory interface and is designed for systems targeting PC100/PC133 timing.

This device targets applications requiring compact, parallel-access volatile memory with pipelined operation, multi-bank operation and programmable burst lengths for efficient read/write throughput in commercial-temperature environments.

Key Features

  • Memory Architecture  256 Mbit SDRAM organized as 32M × 8 with four internal banks for concurrent row access and precharge hiding.
  • SDR Performance  PC100- and PC133-compliant SDR SDRAM; specified for a 133 MHz clock frequency (–75 speed grade) and documented timing options including CL and RCD targets.
  • Timing & Throughput  Access time listed at 5.4 ns and write cycle time (word/page) of 15 ns; internal pipelined operation allows column address changes every clock cycle and programmable burst lengths of 1, 2, 4, 8 or full page.
  • Refresh & Power  Supports auto refresh and self-refresh modes with standard refresh cycles; single 3.3 V ±0.3 V power supply (3.0 V to 3.6 V specified).
  • Interface  LVTTL-compatible inputs/outputs and a parallel memory interface for direct integration into parallel SDRAM systems.
  • Package & Temperature  Supplied in a 60-ball FBGA (8 × 16) package and specified for commercial operating temperature range 0°C to +70°C (TA).
  • System Features  Auto precharge, concurrent auto precharge/auto refresh modes, and internal bank architecture to optimize access sequences and minimize latency.

Typical Applications

  • PC100/PC133-class systems  Use as system SDRAM where PC100/PC133 timing compliance and parallel SDRAM interface are required.
  • Embedded systems with parallel memory buses  Compact SDRAM option for embedded designs needing a 3.3 V parallel SDRAM footprint in a small FBGA package.
  • Buffer and frame storage  Parallel-access frame or data buffering in designs that leverage burst transfers and pipelined column access.

Unique Advantages

  • PC100/PC133 compatibility: Documented compliance with PC100 and PC133 timing targets simplifies integration into existing PC-class memory subsystems.
  • Flexible burst and pipelined operation: Programmable burst lengths and internal pipelining enable efficient sequential data transfers and improved throughput.
  • Compact FBGA package: 60-ball FBGA (8 × 16) provides a small form factor for space-constrained boards while maintaining parallel SDRAM connectivity.
  • Single 3.3 V supply: Operates from a single 3.0 V to 3.6 V supply (3.3 V ±0.3 V), matching common system power rails.
  • Commercial temperature rating: Specified for 0°C to +70°C operation for typical commercial deployments.

Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?

The MT48LC32M8A2FB-75:D TR positions itself as a compact, parallel SDRAM solution for designs needing 256 Mbit of volatile storage with PC100/PC133 timing support, pipelined access, and multi-bank operation. Its combination of programmable burst lengths, standard refresh modes and a small 60-ball FBGA package makes it suitable for space-constrained commercial designs that require proven SDRAM behavior.

This device is appropriate for engineers and procurement teams building systems with parallel SDRAM interfaces that prioritize footprint, predictable timing (133 MHz speed grade), and a standard 3.3 V supply. The documented feature set and timing information support straightforward integration and long-term maintainability in compatible system architectures.

If you require pricing, availability, or a formal quote for MT48LC32M8A2FB-75:D TR, request a quote or submit an inquiry to our team for further assistance.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up