MT48LC32M8A2P-6A:D

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 1,051 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC32M8A2P-6A:D – IC DRAM 256MBIT PAR 54TSOP II

The MT48LC32M8A2P-6A:D is a 256 Mbit synchronous DRAM organized as 32M × 8 with a parallel memory interface in a 54-pin TSOP II package. It targets commercial-temperature applications requiring a fully synchronous SDRAM solution with PC100/PC133 compatibility and straightforward board-level integration.

Key characteristics include a 167 MHz clock grade, 5.4 ns access time, single 3.3 V supply range, and a 54-TSOP (400 mil / 10.16 mm width) package suited for space-constrained designs.

Key Features

  • Core Architecture Fully synchronous SDRAM with internal pipelined operation and four internal banks to optimize row access and precharge handling.
  • Memory Organization & Density 256 Mbit capacity organized as 32M × 8 (8 Meg × 8 × 4 banks) suitable for parallel DRAM system memory needs.
  • Performance 167 MHz clock frequency (–6A speed grade) with a 5.4 ns access time and programmable CAS latency options consistent with PC100/PC133 timing.
  • Timing & Burst Control Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge and auto refresh modes, and support for standard refresh intervals (8192 cycles).
  • Power Single 3.3 V ±0.3 V supply (3.0 V to 3.6 V) for system-level compatibility with common DRAM power domains.
  • Package & Mounting 54-pin TSOP II (0.400" / 10.16 mm width) plastic package for surface-mount assembly and compact PCB layouts.
  • Operating Range Commercial temperature rating of 0°C to +70°C (TA), matching standard commercial system requirements.
  • Interface Parallel SDRAM interface with LVTTL-compatible inputs/outputs for direct integration into synchronous memory buses.

Typical Applications

  • Commercial Embedded Systems System memory for embedded controllers and processing modules operating within commercial temperature ranges.
  • Consumer Electronics Synchronous DRAM for devices requiring parallel SDRAM density and timing predictable for display or buffering tasks.
  • Networking & Communications Equipment Buffer and working memory in network modules where PC100/PC133 timing compatibility and low-latency access are required.

Unique Advantages

  • Verified PC100/PC133 Timing Compatibility: Designed to meet PC100 and PC133 timing profiles, easing integration into systems targeting those clock domains.
  • High-Frequency Operation: 167 MHz speed grade delivers low access latency (5.4 ns) for workloads sensitive to read/write response times.
  • Compact TSOP II Package: 54-pin TSOP II (400 mil / 10.16 mm) enables dense board layouts while providing standard surface-mount mounting.
  • Flexible Burst and Refresh Modes: Programmable burst lengths, auto precharge, and auto refresh modes simplify memory control and improve throughput predictability.
  • Single-Supply Simplicity: Operates from a single 3.3 V supply (3.0–3.6 V), simplifying power-rail design in commercial systems.
  • Commercial Temperature Specification: 0°C to +70°C rating aligns with typical commercial deployments and thermal profiles.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The MT48LC32M8A2P-6A:D offers a straightforward, fully synchronous 256 Mbit SDRAM solution tailored for commercial-temperature systems that require predictable timing, PC100/PC133 compatibility, and compact packaging. Its 32M × 8 organization, 167 MHz speed grade, and programmable burst modes make it suitable for designs where low-latency parallel memory and standard SDRAM control are priorities.

This part is appropriate for engineers and procurement teams building commercial embedded platforms, consumer devices, or networking equipment who need a verified synchronous DRAM memory device with a small-footprint TSOP II package and standard 3.3 V supply requirements.

If you would like pricing, availability, or to request a formal quote for the MT48LC32M8A2P-6A:D, please submit a quote request or inquiry to receive further assistance.

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