MT48LC32M8A2FB-7E:D TR

The MT48LC32M8A2FB-7E:D TR is a 256 Mbit synchronous DRAM device organized as 32M × 8 with internal bank architecture and a parallel memory interface. It implements SDR SDRAM operation with a 133 MHz clock frequency and is offered in a compact 60-ball FBGA package (8 mm × 16 mm).

Designed for system memory applications that require synchronous, pipelined DRAM functionality, this device provides programmable burst lengths, internal bank management, and standard PC100/PC133 timing options for integration into legacy PC-class and board-level memory designs.

Key Features

• Memory Type & Organization 256 Mbit SDRAM organized as 32M × 8 with four internal banks (8M × 8 × 4 banks as listed in the datasheet).
• Clocking & Timing 133 MHz clock frequency (–7E speed grade). Datasheet timing for –7E indicates RCD–RP–CL = 2–2–2 and a CAS latency corresponding to approximately 15 ns at 133 MHz.
• Access & Cycle Times Typical access time listed as 5.4 ns and a write cycle time (word page) of 14 ns.
• SDR SDRAM Architecture Fully synchronous operation with registered inputs on the positive clock edge, internal pipelining, column address change every clock cycle, and internal banks for hiding row access and precharge.
• Burst & Refresh Features Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge and auto refresh modes, and self-refresh support (self-refresh not available on AT devices as noted in the datasheet).
• Voltage & I/O Single-supply operation at 3.3 V ±0.3 V (3.0–3.6 V specified). LVTTL-compatible inputs and outputs per the datasheet.
• Package & Temperature 60-ball FBGA package (60-FBGA, 8 × 16 mm) in a commercial operating temperature range of 0 °C to +70 °C (TA).
• Standards Compliance PC100- and PC133-compliant timing options are specified in the product documentation.

Typical Applications

• PC-class memory subsystems — Use where PC100/PC133-compliant SDRAM timing and 3.3 V supply compatibility are required.
• Board-level memory expansion — 60-ball FBGA package enables compact, board-mounted DRAM solutions for space-constrained designs.
• Synchronous DRAM designs — Pipelined, banked architecture and programmable burst lengths support systems that require predictable, clock-synchronous memory access patterns.

Unique Advantages

• PC100/PC133 compatibility: Provides industry-standard SDRAM timing options for integration into legacy PC and system designs that reference these standards.
• Compact FBGA package: 60-ball FBGA (8 mm × 16 mm) reduces PCB footprint for high-density board-level memory placement.
• Synchronous, pipelined operation: Registered inputs and internal pipelining allow column address changes each clock cycle and efficient data flow under clocked operation.
• Flexible burst and refresh control: Programmable burst lengths and auto/self-refresh features simplify controller implementation and support continuous operation modes.
• Single 3.3 V supply: Standard 3.3 V ±0.3 V operation aligns with common system power rails to simplify power design.
• Commercial temperature rating: Specified operation from 0 °C to +70 °C for typical commercial applications.

Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?

The MT48LC32M8A2FB-7E:D TR delivers synchronous SDRAM functionality in a 256 Mbit density with a 32M × 8 organization and four internal banks, offering predictable, pipelined performance at 133 MHz. Its PC100/PC133 timing options, programmable burst lengths, and auto/self-refresh support provide design flexibility for systems relying on standard SDRAM timing and behavior.

With a compact 60-ball FBGA package and single 3.3 V supply operation, this device is suitable for board-level memory integration in space-constrained, commercially-rated designs that require synchronous DRAM operation and standard timing compatibility.

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