MT48LC32M8A2P-6A IT:G

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 843 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC32M8A2P-6A IT:G – IC DRAM 256Mbit PAR 54TSOP II

The MT48LC32M8A2P-6A IT:G is a 256 Mbit synchronous DRAM device organized as 32M × 8 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous SDRAM architecture with internal pipelined operation and multiple internal banks.

Targeted at systems requiring PC100/PC133-class SDRAM timing and industrial temperature operation, the device delivers high-speed operation up to 167 MHz while operating from a single 3.3 V ±0.3 V supply (3.0–3.6 V) and an industrial ambient temperature range of −40 °C to +85 °C.

Key Features

  • Core / Architecture  Fully synchronous SDRAM with internal pipelined operation and multiple internal banks for hidden row access and precharge.
  • Memory Organization  256 Mbit density organized as 32M × 8 with four internal banks.
  • Performance / Timing  Speed grade -6A supports 167 MHz system clock with typical CL = 3 timing; access time listed as 5.4 ns and write cycle time (word/page) of 12 ns.
  • Burst and Refresh  Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh and self-refresh modes; 8192-cycle refresh supported.
  • Voltage and I/O  Single 3.3 V ±0.3 V power supply with LVTTL-compatible inputs and outputs; operating supply range 3.0–3.6 V.
  • Package & Mounting  54-pin TSOP II (0.400", 10.16 mm width) plastic package intended for board-level mounting.
  • Industrial Temperature Range  Rated for −40 °C to +85 °C ambient (TA) for industrial applications.

Typical Applications

  • PC and Legacy System Memory  Designed for systems requiring PC100/PC133-compliant SDRAM timing and synchronous operation.
  • Industrial Embedded Systems  Industrial temperature rating (−40 °C to +85 °C) and standard 3.3 V supply make it suitable for industrial controllers and embedded platforms.
  • Board-Level Data Buffering  Parallel interface and programmable burst lengths support buffering and burst transfer use cases in board-level memory subsystems.
  • High-Speed Memory Arrays  32M × 8 organization and internal banks enable use in designs requiring moderate density synchronous DRAM.

Unique Advantages

  • High clock-rate capability: Supports a 167 MHz clock (speed grade -6A), enabling low-latency synchronous memory operation when used with matching system timing.
  • Flexible burst control: Programmable burst lengths (1, 2, 4, 8, full page) allow designers to optimize transfer granularity for throughput or latency.
  • Industrial temperature support: Specified for −40 °C to +85 °C ambient operation to meet industrial application thermal requirements.
  • Standard 3.3 V supply: Operates from a single 3.3 V ±0.3 V supply (3.0–3.6 V), simplifying power design in existing 3.3 V systems.
  • Compact TSOP II footprint: 54-pin TSOP II package (0.400", 10.16 mm width) provides a compact, board-level mount option for space-constrained designs.
  • Synchronous, pipelined operation: All signals registered on the positive clock edge with internal pipelining and multiple banks to improve effective throughput in burst transfers.

Why Choose MT48LC32M8A2P-6A IT:G?

The MT48LC32M8A2P-6A IT:G is a straightforward, industry-temperature SDRAM offering 256 Mbit density with synchronous, pipelined operation and PC100/PC133-class timing. Its combination of 32M × 8 organization, programmable burst lengths, and a 54-pin TSOP II package makes it appropriate for embedded and industrial designs that require standard 3.3 V operation and a compact board-level memory solution.

This device is suited to engineers specifying reliable, synchronous DRAM for systems where established SDRAM feature sets (auto refresh, self-refresh, internal banks) and industrial temperature range are required. Its clear electrical and timing characteristics simplify integration into designs that match PC100/PC133 timing or that need a 167 MHz capable memory element.

If you need pricing, availability or a formal quote for MT48LC32M8A2P-6A IT:G, request a quote or submit an inquiry for sales and ordering information.

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