MT48LC32M16A2TG-75 IT:C TR

The MT48LC32M16A2TG-75 IT:C TR is a 512 Mbit parallel SDRAM device organized as 32M × 16 with four internal banks. It implements fully synchronous SDR SDRAM architecture and is supplied in a 54-pin TSOP II (400 mil) package.

This device is suitable for systems that require a parallel SDRAM interface and PC100/PC133-compliant timing, offering 133 MHz clock operation, 5.4 ns access time, and industrial operating temperature capability.

Key Features

• Memory Core and Organization 512 Mbit density arranged as 32M × 16 with 4 internal banks for concurrent row access/precharge management.
• SDR SDRAM Architecture Fully synchronous operation with all signals registered on the positive edge of the system clock; internal pipelined operation allows column address changes every clock cycle.
• Performance PC100- and PC133-compliant timing with a clock frequency of 133 MHz and an access time of 5.4 ns (speed grade -75).
• Programmable Burst and Refresh Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh, and self-refresh modes with 64 ms / 8192-cycle refresh.
• Electrical Single 3.3 V ±0.3 V power supply (product data lists 3.0 V to 3.6 V) and LVTTL-compatible inputs and outputs.
• Timing and Cycle Characteristics Write cycle time (word/page) of 15 ns and timing options documented for CAS latencies supporting CL = 3 at PC133 operation.
• Package and Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package; specified operating temperature range –40°C to +85°C (industrial).

Typical Applications

• PC100/PC133-compliant systems — Use where standard PC100 or PC133 SDRAM timing compatibility is required.
• Parallel SDRAM interface designs — For boards and controllers that implement a parallel SDRAM memory interface.
• Industrial-temperature systems — Designs requiring operation across –40°C to +85°C can leverage the device's industrial temperature rating.
• High-density memory modules — Applications needing 512 Mbit density in a 54-pin TSOP II footprint.

Unique Advantages

• PC100/PC133 timing compliance: Ensures compatibility with systems and controllers that require standard SDRAM timing at up to 133 MHz.
• High-density 32M × 16 organization: Provides 512 Mbit capacity in a single device, simplifying BOM for higher-memory designs.
• Flexible burst and refresh modes: Programmable burst lengths plus auto and self-refresh options support varied access patterns and low-activity retention.
• Industrial temperature rating: Specified –40°C to +85°C operation supports deployment in environments with wider temperature ranges.
• Standard TSOP II package: 54-pin TSOP II (400 mil) package fits established board layouts and module form factors.
• Single 3.3 V supply operation: Simplifies power rail requirements for systems designed around 3.3 V logic.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The MT48LC32M16A2TG-75 IT:C TR delivers PC100/PC133-compliant SDRAM performance in a compact 54-pin TSOP II package with 512 Mbit density and a 32M × 16 organization. Its fully synchronous, pipelined architecture with internal banks and programmable burst modes supports demanding parallel-access memory designs.

With a 133 MHz clock option, 5.4 ns access time, and an industrial –40°C to +85°C rating, this Micron-manufactured SDRAM device is well suited to designs requiring standard SDRAM timing, higher memory density, and temperature robustness while maintaining a single 3.3 V power interface.

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