MT48LC32M8A2TG-7E:D TR

The MT48LC32M8A2TG-7E:D TR is a 256 Mbit SDRAM device organized as 32M × 8 with a parallel memory interface. It is a fully synchronous DRAM designed for PC100- and PC133-compliant systems and supports a single 3.3 V ±0.3 V supply.

This device targets board-level designs that require standard SDRAM features such as internal bank architecture, programmable burst lengths, and structured refresh operation, supplied in a 54-pin TSOP II package for surface-mount mounting.

Key Features

• Core / Architecture Fully synchronous SDR SDRAM with internal, pipelined operation and internal banks to hide row access and precharge operations.
• Memory Organization & Capacity 256 Mbit total capacity organized as 32M × 8 with 4 internal banks (device architecture and configuration per datasheet).
• Performance / Timing Rated for 133 MHz clock frequency with an access time of 5.4 ns and a write cycle time (word/page) of 14 ns. The -7E speed grade targets 133 MHz timing.
• Refresh & Burst Control Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge and auto refresh support, and 64 ms / 8192-cycle refresh timing for commercial operation.
• Power Single-supply operation at 3.0 V to 3.6 V (3.3 V ±0.3 V specified in datasheet).
• Interface Parallel memory interface with LVTTL-compatible inputs and outputs; all signals registered on the positive edge of the system clock.
• Package & Mounting 54-pin TSOP II plastic package (0.400" / 10.16 mm width) designed for surface-mount assembly.
• Operating Temperature Commercial operating range: 0°C to +70°C (TA).

Typical Applications

• PC100/PC133 memory subsystems Use where PC100- and PC133-compliant SDRAM timing and behavior are required.
• Board-level embedded memory 256 Mbit density and parallel SDRAM interface for designs that require standard synchronous DRAM storage at 3.3 V.
• Compact SMD designs 54-pin TSOP II package for applications needing a surface-mount SDRAM package with a 10.16 mm body width.

Unique Advantages

• PC100/PC133 compatibility: Documented compliance with PC100 and PC133 timing classes simplifies integration into systems designed to those standards.
• Flexible burst and bank architecture: Programmable burst lengths and internal banks enable efficient, pipelined memory access and column-address changes every clock cycle.
• Standard 3.3 V supply: Operates from 3.0 V to 3.6 V, aligning with common DDR/SDR power domains and simplifying power-rail design.
• Commercial temperature grade: Specified for 0°C to +70°C operation for designs targeting commercial environments.
• Compact surface-mount package: 54-pin TSOP II (0.400", 10.16 mm) package offers a board-friendly footprint for high-density layouts.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The MT48LC32M8A2TG-7E:D TR provides a standardized SDRAM solution with documented PC100/PC133 compatibility, a 256 Mbit density in a 32M × 8 organization, and the timing characteristics needed for synchronous, pipelined memory operation. Its single 3.3 V supply, programmable burst modes, and internal bank architecture make it suitable for designs requiring conventional SDRAM behavior in a compact TSOP II package.

This device is appropriate for engineers and procurement teams designing commercial-temperature embedded systems or memory subsystems that require a straightforward, compliant SDRAM component backed by datasheet-specified timing, refresh, and package information.

Request a quote or submit a pricing and availability inquiry for MT48LC32M8A2TG-7E:D TR to receive detailed lead-time and ordering information.