MT48LC32M8A2TG-75 IT:D

The MT48LC32M8A2TG-75 IT:D is a 256 Mbit synchronous DRAM (SDR SDRAM) organized as 32M × 8 with a parallel memory interface in a 54-pin TSOP II package. It operates at up to 133 MHz (PC133-compliant) and is supplied from a single 3.3 V ±0.3 V rail.

Designed for board-level memory expansion in industrial and embedded systems, the device provides programmable burst operation, internal pipelining and banked architecture to support sustained, predictable memory access patterns in synchronous systems.

Key Features

• Core / Architecture  Fully synchronous SDRAM with internal pipelined operation and four internal banks for overlapping row access and precharge.
• Memory Organization  256 Mbit capacity organized as 32M × 8 (8 Meg × 8 × 4 banks), supporting standard row/column addressing.
• Performance  PC100 and PC133-compliant operation with a clock frequency up to 133 MHz and an access time specification (noted) supporting low-latency read/write cycles.
• Timing Options  Programmable burst lengths (1, 2, 4, 8 or full page), auto precharge, auto refresh and self-refresh modes; speed-grade -75 corresponds to 133 MHz with 3-3-3 timing.
• Power  Single 3.3 V supply (3.0 V to 3.6 V) for standard system-level integration.
• Package  54-pin TSOP II (0.400", 10.16 mm width) plastic package optimized for board-level assembly.
• Industrial Temperature Range  Specified operating ambient range of −40 °C to +85 °C (TA) for use in industrial environments.
• Write and Cycle Timing  Documented write cycle and page timings (example: write cycle time for word/page 15 ns) to aid deterministic timing design.

Typical Applications

• Embedded Systems  Board-level DRAM for embedded controllers and processors requiring synchronous parallel memory expansion.
• Industrial Control  Memory for control and automation electronics where the −40 °C to +85 °C ambient rating is required.
• Legacy PC/Subsystem Memory  Replacement or upgrade memory in systems designed for PC100/PC133-class SDRAM modules and components.
• Board-Level Memory Buffers  Local frame or data buffering on carrier boards using a 54-pin TSOP II footprint.

Unique Advantages

• Standard SDRAM timing and compliance: PC100 and PC133 compliance simplifies integration into systems designed around these standards.
• Flexible burst and refresh modes: Programmable burst lengths plus auto and self-refresh modes provide flexibility for varied access patterns and low-activity retention.
• Industrial temperature capability: Specified −40 °C to +85 °C operating range supports deployment in harsher ambient conditions.
• Compact TSOP II package: 54-pin TSOP II (0.400") packaging facilitates high-density board layouts while maintaining a parallel interface.
• Single-supply operation: 3.0 V to 3.6 V single-supply operation reduces power-supply complexity in system design.

Why Choose MT48LC32M8A2TG-75 IT:D?

The MT48LC32M8A2TG-75 IT:D offers a well-documented, industry-standard SDRAM option from Micron with 256 Mbit density, PC100/PC133 timing compatibility and a 54-pin TSOP II package for board-level memory needs. Its combination of synchronous operation, internal pipelining, programmable burst modes and industrial ambient rating make it suitable for embedded and industrial designs that require predictable, parallel DRAM performance.

This part is ideal for engineers and procurement teams seeking a proven SDRAM device with clear timing options, single-supply operation, and a compact footprint for system memory expansion or buffering on legacy and new designs.

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