MT48LC32M8A2P-7E:D

The MT48LC32M8A2P-7E:D is a 256 Mbit, parallel SDRAM device organized as 32M × 8 with a 54-pin TSOP II package. It implements fully synchronous SDR SDRAM architecture with internal banks and pipelined operation to support high-rate burst transfers.

This device is targeted for systems that require volatile, high-frequency parallel memory with PC100/PC133-compliant timing and a single 3.3 V ±0.3 V power supply. It offers features for burst operation, auto refresh/precharge, and LVTTL-compatible I/O to integrate into standard synchronous memory interfaces.

Key Features

• Core / Architecture  256 Mbit SDRAM organized as 32M × 8 with 4 internal banks for concurrent row access and precharge.
• Memory & Access  Parallel SDRAM format with programmable burst lengths (1, 2, 4, 8 or full page); access time specified as 5.4 ns.
• Performance  PC100- and PC133-compliant operation with a clock frequency of 133 MHz (speed grade -7E) and write cycle time (word/page) of 14 ns.
• Power  Single-supply operation over 3.0 V to 3.6 V (3.3 V ±0.3 V per datasheet).
• Refresh & Power Management  Auto refresh and auto precharge support plus self-refresh mode (note: self-refresh not available on AT devices); commercial refresh timing of 64 ms / 8192 cycles.
• I/O & Compatibility  LVTTL-compatible inputs and outputs with all signals registered on the positive edge of the system clock.
• Package & Mounting  54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount applications; supplier device package listed as 54-TSOP II.
• Operating Range  Commercial temperature range: 0 °C to +70 °C (TA).

Typical Applications

• System Memory (Embedded Systems)  Used as parallel SDRAM main memory where a 256 Mbit volatile store at 133 MHz is required.
• Consumer Electronics  Integration in commercial-temperature devices that require PC100/PC133-compliant SDRAM in a compact 54-pin TSOP II package.
• Legacy and Industrial Designs  Replacement or upgrade of existing parallel SDRAM footprints that match the 54-TSOP II form factor and 3.3 V supply.

Unique Advantages

• Standard PC100/PC133 timing compliance: Enables straightforward integration into systems designed for these industry timing classes.
• Flexible burst operation: Programmable burst lengths and pipelined column operations allow designers to optimize throughput for burst-oriented memory access patterns.
• Robust refresh options: Auto refresh, auto precharge, and self-refresh support (with noted device exceptions) simplify memory maintenance and power management.
• Compact surface-mount package: 54-pin TSOP II (0.400" / 10.16 mm) provides a space-efficient footprint for board-level implementations.
• Standard 3.3 V supply and LVTTL I/O: Matches common system voltage rails and logic levels for straightforward interface design.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The MT48LC32M8A2P-7E:D offers a commercial-temperature, 256 Mbit SDRAM solution in a compact 54-pin TSOP II package, combining synchronous, pipelined operation with PC100/PC133 timing compatibility. Its 32M × 8 organization, internal banking, and programmable burst modes make it suitable for designs that require parallel volatile memory with standard 3.3 V operation.

Choose this device when you need a verifiable, specification-driven SDRAM part that aligns with existing PC100/PC133 system timing, fits TSOP II footprints, and delivers standard refresh and power-management features appropriate for commercial-temperature embedded and consumer applications.

If you would like pricing, availability, or to request a quote for the MT48LC32M8A2P-7E:D, please submit a request or contact sales to discuss your requirements and volume needs.