MT48LC32M8A2P-75:D

The MT48LC32M8A2P-75:D is a 256 Mbit synchronous DRAM device organized as 32M × 8 with a parallel memory interface. It implements SDR SDRAM architecture with internal banks, programmable burst lengths and synchronous operation tied to a system clock.

Designed for commercial-temperature applications, the device targets systems that require PC100/PC133-class parallel SDRAM memory operating at up to 133 MHz with a single 3.0–3.6 V supply and a compact 54-pin TSOP II package.

Key Features

• Memory Architecture — 256 Mbit organized as 32M × 8 with 4 internal banks, providing standard DRAM organization for parallel-system designs.
• SDR SDRAM Core — Fully synchronous SDRAM; all signals are registered on the positive edge of the system clock and internal pipelining allows column-address changes every clock cycle.
• PC100 / PC133 Compliance — Device is described as PC100- and PC133-compliant with a clock frequency option at 133 MHz (speed grade -75).
• Timing and Performance — Specified clock frequency of 133 MHz and an access time listed at 5.4 ns; write cycle time (word/page) of 15 ns. CAS latency and timing targets are defined by speed grade.
• Programmable Burst & Refresh — Supports programmable burst lengths (1, 2, 4, 8, full page), auto precharge, auto refresh and self-refresh modes as documented for the family.
• Power — Single supply operation across 3.0 V to 3.6 V for standard 3.3 V systems.
• Package & Mounting — 54-pin TSOP II (0.400", 10.16 mm width) plastic package suitable for surface-mount assembly.
• Operating Range — Commercial operating temperature range of 0°C to +70°C (TA).

Typical Applications

• Embedded Systems — Provides parallel SDRAM capacity for legacy and contemporary embedded controllers requiring 256 Mbit memory in a TSOP II package.
• Networking & Communications — Suitable for buffer and working memory in network devices where PC100/PC133-class SDRAM timing and parallel interface are required.
• Consumer and Industrial Electronics — Fits designs needing synchronous DRAM with commercial temperature range and standard 3.3 V supply.

Unique Advantages

• Standard SDRAM timing and compliance: PC100/PC133-compliant operation at up to 133 MHz enables use in systems designed around those timing classes.
• Flexible burst and bank management: Programmable burst lengths and internal bank structure allow efficient row/column access patterns and higher sustained throughput for burst transfers.
• Compact surface-mount package: 54-pin TSOP II (400 mil) package offers a small-footprint solution for board-level integration.
• Single-supply compatibility: 3.0–3.6 V operation aligns with standard 3.3 V system power rails for straightforward integration.
• Commercial temperature-rated: Rated for 0°C to +70°C operation for use in typical commercial electronics environments.

Why Choose MT48LC32M8A2P-75:D?

The MT48LC32M8A2P-75:D delivers a proven SDR SDRAM architecture with 256 Mbit density, PC100/PC133-class timing, and a standard 54-pin TSOP II package for compact, board-level integration. Its synchronous operation, programmable burst lengths and internal bank architecture make it appropriate for systems that require predictable, clock-synchronous parallel memory behavior.

This device is suited to designers and procurement teams specifying commercial-temperature parallel SDRAM at 3.3 V, and it is supported by Micron documentation for timing, refresh and mode options to aid system design and validation.

Request a quote or submit an inquiry to receive pricing and availability for the MT48LC32M8A2P-75:D and to discuss volume, lead times, or qualification details.