MT48LC32M8A2P-75 L:D TR

The MT48LC32M8A2P-75 L:D TR is a 256 Mbit SDRAM organized as 32M × 8 with a parallel memory interface in a 54‑pin TSOP II package. It is a fully synchronous DRAM device designed for commercial-temperature memory applications that require PC100/PC133-compatible synchronous DRAM operation.

With a 133 MHz clock frequency, internal pipelined operation and multiple refresh and precharge modes, this device targets systems that need predictable, clock‑synchronous DRAM behavior in a compact 54‑TSOP (0.400", 10.16 mm width) footprint.

Key Features

• Core / Architecture 256 Mbit SDRAM organized as 32M × 8 with 4 internal banks; fully synchronous with all signals registered on the positive edge of the system clock.
• Standards / Timing PC100- and PC133-compliant with a 133 MHz clock frequency (‑75 speed grade). Typical access timing examples and CL options are defined in the datasheet.
• Performance Internal pipelined operation allows column address changes each clock cycle; programmable burst lengths (1, 2, 4, 8, or full page) support flexible data transfer patterns.
• Memory Management Internal banks for row access/precharge hiding, auto precharge, auto refresh and a self‑refresh mode (self‑refresh not available on AT devices as noted).
• Power Single 3.3 V power supply range specified as 3.0 V to 3.6 V.
• Package 54‑pin TSOP II (0.400", 10.16 mm width) plastic package; surface‑mount 54‑TSOP form factor for compact board integration.
• Operating Range Commercial operating temperature range: 0°C to +70°C (TA).
• Additional Timing Write cycle time (word/page) specified at 15 ns; published timing options include several cycle‑time and CL permutations (see device part numbering and timing tables).

Typical Applications

• Embedded systems — Provides 256 Mbit of synchronous DRAM for controllers and processors requiring a parallel SDRAM interface in a compact TSOP II package.
• Consumer electronics — Suitable for commercial-temperature consumer devices that need PC100/PC133-compatible SDRAM density and timing options.
• Networking and communications equipment — Serves as external volatile memory for buffering and packet handling where synchronous, pipelined memory access is required.
• Industrial control (commercial temperature) — Fits commercial‑temperature control and instrumentation systems requiring standard 3.3 V SDRAM operation.

Unique Advantages

• Standardized timing compatibility: PC100 and PC133 compliance simplifies integration with existing PC100/PC133 timing domains and system designs.
• Flexible burst and pipelined operation: Programmable burst lengths and internal pipelining enable designers to tailor transfers for streaming or block‑transfer workloads.
• Compact surface‑mount package: 54‑TSOP II footprint (0.400", 10.16 mm width) facilitates high‑density board layouts and replacement of legacy TSOP DRAMs.
• Synchronous, registered signaling: All inputs registered on the positive clock edge provide predictable timing behavior for synchronous system architectures.
• Commercial temperature assurance: Specified 0°C to +70°C operating range for use in standard commercial environments.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The MT48LC32M8A2P-75 L:D TR delivers a compact, standard‑timing 256 Mbit SDRAM solution with a 32M × 8 organization and a 54‑pin TSOP II package. Its PC100/PC133 compatibility, internal pipelining, programmable burst lengths and supported auto‑refresh/precharge modes make it suitable for designs that require synchronous, parallel DRAM with predictable timing and flexible access patterns.

This device is well suited to engineers and procurement teams selecting a commercial‑temperature SDRAM for embedded, consumer or networking applications that demand standard 3.3 V operation and a small surface‑mount form factor.

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