MT48LC4M32B2B5-7 IT:G

IC DRAM 128MBIT PAR 90VFBGA
Part Description

IC DRAM 128MBIT PAR 90VFBGA

Quantity 100 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-VFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page14 nsPackaging90-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M32B2B5-7 IT:G – IC DRAM 128MBIT PAR 90VFBGA

The MT48LC4M32B2B5-7 IT:G is a 128 Mbit volatile SDRAM device organized as 4M × 32 in a 90‑VFBGA (8×13) package. It provides parallel SDRAM architecture with defined timing and supply characteristics for system memory and data buffering applications that require a compact BGA footprint.

With a 143 MHz clock frequency, 5.5 ns access time and support for 3.0 V to 3.6 V supply, this device balances accessible performance, a defined operating temperature range and a space-efficient package for embedded and board-level designs.

Key Features

  • Memory Core (SDRAM) Organized as 4M × 32 providing a total capacity of 128 Mbit in synchronous DRAM architecture.
  • Performance 143 MHz clock frequency with a typical access time of 5.5 ns and a word/page write cycle time of 14 ns for predictable memory timing.
  • Interface Parallel memory interface suitable for integration with parallel SDRAM controllers and standard bus architectures.
  • Voltage Operates from 3.0 V to 3.6 V, enabling use in 3V-class system power domains.
  • Package 90‑VFBGA package (8×13) for high-density board assemblies and surface-mount applications.
  • Temperature Range Specified operating temperature from −40°C to 85°C (TA), supporting a broad thermal envelope for many electronic systems.

Unique Advantages

  • Compact BGA footprint: 90‑VFBGA (8×13) package reduces board area for space-constrained designs.
  • Predictable latency: 5.5 ns access time and 14 ns write cycle time provide deterministic memory timing for system design.
  • Parallel interface simplicity: Parallel SDRAM organization (4M × 32) simplifies integration with parallel memory controllers.
  • Wide operating temperature: Rated −40°C to 85°C (TA) to support applications across commercial and industrial thermal ranges.
  • 3V-class compatibility: 3.0–3.6 V supply range aligns with common 3V system power rails.

Why Choose MT48LC4M32B2B5-7 IT:G?

The MT48LC4M32B2B5-7 IT:G delivers a compact, parallel SDRAM solution with clearly defined timing and electrical parameters that suit board-level memory requirements where a 128 Mbit capacity and 90‑VFBGA package are required. Its combination of a 4M × 32 organization, 143 MHz clocking capability and a broad operating temperature range makes it appropriate for designs needing reliable, space-efficient volatile memory.

Engineers and procurement teams seeking a standardized SDRAM device with predictable access characteristics and 3V-class supply compatibility will find this part aligns with designs that prioritize integration density, defined timing, and thermal robustness.

Request a quote or submit a product inquiry to obtain pricing, availability and additional ordering information for the MT48LC4M32B2B5-7 IT:G.

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