MT48LC4M32B2F5-6:G TR
| Part Description |
IC DRAM 128MBIT PAR 90VFBGA |
|---|---|
| Quantity | 888 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-VFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.5 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M32B2F5-6:G TR – IC DRAM 128MBIT PAR 90VFBGA
The MT48LC4M32B2F5-6:G TR is a 128 Mbit volatile DRAM organized as 4M × 32, based on SDRAM technology with a parallel memory interface. It is provided in a 90-VFBGA (8x13) package and operates from a 3.0 V to 3.6 V supply.
This device is intended for designs that require a moderate-density parallel SDRAM solution with a 167 MHz clock capability and sub-6 ns access performance, suitable for systems that integrate discrete SDRAM components in compact board footprints.
Key Features
- Memory Type & Technology Volatile SDRAM organized as 4M × 32 (128 Mbit) with a parallel memory interface for direct connection to parallel memory controllers.
- Performance Supports a clock frequency of 167 MHz with an access time of 5.5 ns and a word/page write cycle time of 12 ns, enabling deterministic read/write timing for matched system designs.
- Power Operates from a supply voltage range of 3.0 V to 3.6 V.
- Package & Mounting Supplied in a 90-VFBGA (8x13) ball-grid array footprint to minimize PCB area while supporting surface-mount assembly.
- Operating Conditions Specified for an ambient operating temperature range of 0°C to 70°C (TA).
Typical Applications
- Embedded memory subsystems Used as 128 Mbit parallel SDRAM storage where a 4M × 32 organization and 167 MHz clocking meet system memory requirements.
- Consumer and industrial electronics Integrated into designs requiring compact BGA-mounted SDRAM modules operating at standard commercial temperature ranges.
- Board-level memory expansion Employed as a discrete parallel DRAM device to expand memory capacity on custom PCBs while conserving board area with the 90-VFBGA package.
Unique Advantages
- Balanced density and organization: 128 Mbit capacity in a 4M × 32 organization provides byte-wide data paths suitable for parallel SDRAM interfaces.
- Deterministic timing: 5.5 ns access time and 12 ns write cycle time support predictable memory timing for system design margins.
- Compact BGA footprint: The 90-VFBGA (8x13) package reduces PCB area compared with larger-package alternatives.
- Standard supply voltage: 3.0 V to 3.6 V supply range aligns with common system power rails for straightforward power design.
- Commercial temperature rating: Specified 0°C to 70°C operating range for use in typical commercial environments.
Why Choose IC DRAM 128MBIT PAR 90VFBGA?
The MT48LC4M32B2F5-6:G TR positions itself as a straightforward parallel SDRAM building block combining 128 Mbit density, a 4M × 32 organization, 167 MHz clock support and fast access timing. Its 90-VFBGA package enables compact board-level integration while the 3.0 V–3.6 V supply and commercial temperature rating make it suitable for a range of standard electronic designs.
This device is well suited to engineers and procurement teams seeking a verifiable, specification-driven SDRAM component for systems that require moderate memory capacity, predictable timing, and a compact BGA footprint.
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