MT48LC4M32B2P-6:G
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 901 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.5 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M32B2P-6:G – IC DRAM 128MBIT PAR 86TSOP II
The MT48LC4M32B2P-6:G is a 128 Mbit volatile memory device implemented as SDRAM with a 4M × 32 organization and a parallel memory interface. It provides defined timing and electrical characteristics for designs that require discrete parallel SDRAM components in an 86-TSOP II package.
Key design attributes include a 167 MHz clock frequency, a 3.0–3.6 V supply range, and a commercial operating temperature range of 0°C to 70°C (TA), making the device suitable for standard embedded and electronic systems that specify these parameters.
Key Features
- Memory Core 128 Mbit SDRAM organized as 4M × 32 for word-aligned parallel data access.
- Performance Supports a 167 MHz clock frequency with an access time of 5.5 ns and a write cycle time (word/page) of 12 ns, providing defined timing for system memory operations.
- Power Operates from a 3.0 V to 3.6 V supply range, compatible with common 3 V system rails.
- Interface Parallel memory interface for direct integration into systems expecting parallel SDRAM signaling.
- Package Supplied in an 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) package for surface-mount PCB assembly.
- Temperature Range Rated for operation from 0°C to 70°C (TA), suitable for commercial-temperature applications.
Unique Advantages
- 128 Mbit Density: Provides a mid-range memory capacity (128 Mbit) in a single-device solution to meet moderate memory requirements without additional components.
- Defined Timing Characteristics: Specified access time (5.5 ns) and write cycle time (12 ns) allow predictable integration and timing budgeting in system designs.
- Wide 3.0–3.6 V Supply Range: Matches common 3 V supply rails for straightforward power system integration.
- Standard 86-TSOP II Package: Compact 86-TFSOP package (0.400", 10.16 mm width) supports surface-mount assembly and standard PCB layout practices.
- Parallel Interface: Parallel memory interface enables direct connection to controllers and systems requiring parallel SDRAM topology.
- Commercial Temperature Rating: 0°C to 70°C operating range aligns with commercial embedded system requirements.
Why Choose IC DRAM 128MBIT PAR 86TSOP II?
The MT48LC4M32B2P-6:G positions itself as a straightforward parallel SDRAM component offering explicit electrical and timing specifications—128 Mbit capacity, 4M × 32 organization, 167 MHz clock, and defined access/write timings—packaged in an industry-standard 86-TSOP II footprint. These attributes make it suitable for designs that require a discrete SDRAM device with clear integration parameters.
This device is well suited to engineers and procurement teams specifying commercial-temperature SDRAM with a 3.0–3.6 V supply and parallel interface. Its documented timings, package, and voltage range provide predictable implementation and supply-chain clarity for integration into systems with matching requirements.
Request a quote or contact sales to inquire about pricing, availability, and lead times for the MT48LC4M32B2P-6:G.
