MT48LC4M32B2P-6A IT:L
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 1,427 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M32B2P-6A IT:L – IC DRAM 128MBIT PAR 86TSOP II
The MT48LC4M32B2P-6A IT:L is a 128 Mbit volatile SDRAM device organized as 4M × 32 with a parallel memory interface. It provides synchronous DRAM performance with a specified clock frequency of 167 MHz and an access time of 5.4 ns.
Packaged in an 86-TSOP II (86-TFSOP, 0.400" / 10.16 mm width) and operating over a -40°C to 85°C ambient range, this device is targeted at systems that require mid-density parallel SDRAM memory operating at standard 3.0–3.6 V supply levels.
Key Features
- Memory Type Volatile SDRAM organized as 4M × 32 for a total memory size of 128 Mbit.
- Performance Clock frequency 167 MHz with an access time of 5.4 ns and a write cycle time (word/page) of 12 ns.
- Interface Parallel memory interface suitable for synchronous DRAM system architectures.
- Power Designed for a 3.0 V to 3.6 V supply range.
- Package 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) surface-mount package for board-level integration.
- Operating Temperature Specified ambient operating range of -40°C to 85°C (TA).
- Manufacturer Produced by Micron Technology Inc.
Typical Applications
- Embedded memory subsystems Used as parallel SDRAM storage where a 128 Mbit volatile memory component is required.
- Board-level DRAM expansion Integrated on PCBs that need a 4M × 32 SDRAM device in an 86-TSOP II package.
- Industrial electronic systems Applicable in systems that operate within the device’s -40°C to 85°C ambient temperature range and 3.0–3.6 V supply.
Unique Advantages
- Clear memory density and organization: 128 Mbit capacity organized as 4M × 32 provides a defined memory footprint for system designers.
- Defined timing performance: 167 MHz clock frequency and 5.4 ns access time offer predictable synchronous DRAM timing for system timing budgets.
- Standard supply range: Operates from 3.0 V to 3.6 V, matching common SDRAM power rails.
- Wide operating temperature window: Rated for -40°C to 85°C ambient operation to support a range of temperature environments.
- Compact surface-mount package: 86-TSOP II (86-TFSOP) package provides a small board footprint for dense PCB layouts.
- Vendor pedigree: Manufactured by Micron Technology Inc., providing traceable device sourcing.
Why Choose IC DRAM 128MBIT PAR 86TSOP II?
The MT48LC4M32B2P-6A IT:L positions itself as a straightforward 128 Mbit parallel SDRAM option offering defined timing (167 MHz clock, 5.4 ns access) and a common 3.0–3.6 V supply envelope. Its 4M × 32 organization and TSOP II packaging make it suitable for designers specifying a mid-density synchronous DRAM device for board-level integration.
This device is appropriate for engineers and procurement teams who require explicit, verifiable DRAM specifications—capacity, timing, voltage, temperature range, and package—backed by Micron Technology Inc.
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