MT48LC64M8A2TG-75 L:C

The MT48LC64M8A2TG-75 L:C is a 512 Mbit SDRAM device in a 54-pin TSOP II (0.400", 10.16 mm width) package. It implements a synchronous, parallel DRAM architecture with a 64M × 8 organization and four internal banks to support pipelined, high-throughput memory transfers.

Designed for systems that require PC100- and PC133-compliant SDRAM operation, the device offers standard 3.3 V operation (3.0 V to 3.6 V), 133 MHz clock operation (–75 speed grade) and a 5.4 ns access time at CL = 3 for responsive read performance.

Key Features

• Core Architecture: Fully synchronous SDRAM with all signals registered on the positive edge of the system clock and internal pipelined operation for column-address changes every clock cycle.
• Memory Organization: 64M × 8 organization with four internal banks, providing a total density of 512 Mbit for standard parallel memory interfaces.
• PC100 / PC133 Compliance: PC100- and PC133-compliant timing options; the –75 speed grade supports 133 MHz operation with CL = 3 and a 5.4 ns access time.
• Burst and Refresh Modes: Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh and self-refresh support; 64 ms, 8192-cycle refresh specification.
• Electrical: Single 3.3 V ±0.3 V supply (3.0 V to 3.6 V) with LVTTL-compatible inputs and outputs.
• Timing & Performance: Write cycle time (word/page) of 15 ns and timing parameters defined for CL = 2 and CL = 3 modes across supported speed grades.
• Package & Temperature: 54-pin TSOP II (400 mil) package; commercial operating temperature range 0°C to +70°C (TA).

Typical Applications

• PC100/PC133 memory interfaces: Use where PC100- or PC133-compliant SDRAM is required for system memory subsystems.
• Board-level memory expansion: Provides 512 Mbit parallel SDRAM in a 54-pin TSOP II footprint for module or board upgrades.
• 3.3 V system designs: Suited for designs that operate from a 3.0 V to 3.6 V supply and require LVTTL-compatible signaling.

Unique Advantages

• Standards-aligned timing: PC100 and PC133 timing compliance eases integration into systems designed around those SDRAM standards.
• Flexible burst and bank operation: Programmable burst lengths and four internal banks enable efficient pipelined accesses and flexible data transfer patterns.
• Compact TSOP II package: 54-pin, 0.400" TSOP II packaging provides a standardized footprint for space-constrained board designs.
• Robust refresh options: Auto refresh and self-refresh modes with defined 64 ms/8192-cycle refresh behavior simplify memory maintenance in active and low-power states.
• Defined commercial temperature range: Specified operation from 0°C to +70°C for consistent performance in standard commercial environments.

Why Choose MT48LC64M8A2TG-75 L:C?

The MT48LC64M8A2TG-75 L:C provides a straightforward, standards-aligned 512 Mbit SDRAM solution in a 54-pin TSOP II package. Its fully synchronous architecture, PC100/PC133 timing compatibility and flexible burst/refresh features make it suitable for systems requiring a parallel SDRAM memory element with defined timing and electrical characteristics.

This device is well suited for designs that need a 3.3 V SDRAM memory with a compact TSOP II footprint and commercial temperature operation, offering predictable timing (5.4 ns access at CL = 3 for the –75 grade) and standard refresh behavior for reliable integration into existing memory subsystems.

Request a quote or submit an RFQ to obtain pricing and availability for MT48LC64M8A2TG-75 L:C. Our team will assist with lead times and order details.