MT48LC8M16A2P-75 IT:G
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 291 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2P-75 IT:G – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC8M16A2P-75 IT:G is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous, pipelined operation with internal banks and programmable burst lengths for predictable, cycle-registered memory access.
Designed for systems that require a compact parallel SDRAM solution, this device targets industrial and embedded applications that need a 3.3 V supply range and operation across an industrial temperature range (–40°C to +85°C).
Key Features
- Memory Core 128 Mbit SDRAM organized as 8M × 16 with internal bank architecture (4 banks) to hide row access and precharge latency.
- Performance PC100- and PC133-compliant operation with a clock frequency of 133 MHz; datasheet timing options include CAS latency and cycle-time grades to match system timing requirements.
- Access & Cycle Times Fast synchronous operation with noted access time and write-cycle characteristics (access time: 5.4 ns; write cycle time (word/page): 15 ns) for steady data throughput.
- Interface & Operation Fully synchronous, positive-edge clocked signals; pipelined architecture allows column address changes every clock cycle and programmable burst lengths (1, 2, 4, 8, or full page).
- Refresh & Auto Modes Auto refresh (4K refresh cycles) with auto precharge and standard self-refresh support; refresh timing documented for commercial and industrial options.
- Power Single-supply operation at 3.3 V nominal (3.0 V to 3.6 V specified).
- I/O Levels LVTTL-compatible inputs and outputs for interface compatibility with common logic families.
- Package & Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package with industrial operating temperature range –40°C to +85°C (TA).
Typical Applications
- Industrial Embedded Systems Memory for embedded controllers and modules where industrial temperature operation (–40°C to +85°C) and a compact TSOP footprint are required.
- Legacy PC100/PC133 Designs Replacement or subsystem memory in systems designed to PC100/PC133 timing and clock domains.
- Buffering and Data Capture Synchronous, pipelined SDRAM suited for buffering, burst transfers, and temporary data storage in communications or measurement equipment.
- Board-Level Memory Expansion Parallel SDRAM option for designs needing 128 Mbit density in a 54-pin TSOP II package for space-constrained PCBs.
Unique Advantages
- Industrial Temperature Range: Rated for –40°C to +85°C, enabling deployment in temperature-challenging environments without additional thermal qualification notes.
- Synchronous, Pipelined Architecture: Registered, positive-edge clocked signals and internal banks allow consistent timing behavior and column address changes every clock cycle.
- PC100/PC133 Compatibility: Documented compliance with PC100 and PC133 timing grades simplifies integration into existing systems targeting those clock domains.
- Compact TSOP II Footprint: 54-pin TSOP II (0.400", 10.16 mm) package provides a low-profile, board-friendly memory option for dense PCB layouts.
- Flexible Burst and Auto Modes: Programmable burst lengths, auto precharge, and auto refresh modes reduce controller complexity for common memory access patterns.
- Single 3.3 V Supply: Standard 3.3 V ±0.3 V power requirement aligns with common system rails and simplifies power management.
Why Choose MT48LC8M16A2P-75 IT:G?
The MT48LC8M16A2P-75 IT:G offers a compact, industrial-temperature SDRAM solution with synchronous, pipelined operation and PC100/PC133 timing compatibility. Its 128 Mbit density in an industry-standard 54-pin TSOP II package makes it suitable for embedded and board-level memory implementations that require predictable timing and burst transfer capabilities.
This device is appropriate for design teams seeking a documented, industrial-grade parallel SDRAM with standard 3.3 V supply operation, internal banking for reduced latency, and a set of auto-refresh and precharge features that simplify memory controller implementation.
For pricing, lead-time, or to request a formal quote for MT48LC8M16A2P-75 IT:G, please submit a request to initiate procurement and technical clarification.