MT48LC8M16A2P-75 IT:G TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 486 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2P-75 IT:G TR – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC8M16A2P-75 IT:G TR is a 128 Mbit SDRAM device organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It is a fully synchronous, volatile DRAM designed for systems requiring standard SDRAM functionality and board-level memory expansion.
Targeted use cases include embedded and industrial memory applications that benefit from PC100/PC133-compliant timing, a 133 MHz clock capability, and an industrial operating temperature range for reliable operation in wider ambient conditions.
Key Features
- Core Architecture SDR SDRAM, fully synchronous operation with registered inputs on the positive edge of the system clock and internal pipelined operation.
- Memory Organization 128 Mbit capacity organized as 8M × 16 with internal banks for hidden row access and precharge.
- Performance & Timing PC100- and PC133-compliant timing, specified clock frequency of 133 MHz and an access time listed as 5.4 ns; programmable burst lengths (1, 2, 4, 8, or full page).
- Refresh & Power Management Auto refresh (4K refresh cycles) and self-refresh modes including standard and low power options (low power not available on AT devices).
- Interface & Signals Parallel memory interface with LVTTL-compatible inputs and outputs; supports auto precharge and concurrent auto precharge/auto refresh modes.
- Supply & Voltage Single supply operation at 3.3 V nominal (specified 3.0 V to 3.6 V).
- Package & Mounting 54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount board-level integration.
- Operating Temperature Industrial temperature range: –40°C to +85°C (TA).
Typical Applications
- Embedded Systems Provides board-level DRAM memory for microcontroller- or processor-based embedded designs that require synchronous parallel memory.
- Industrial Electronics Industrial-temperature rating supports use in factory automation, control systems, and instrumentation operating across extended ambient ranges.
- Legacy/PC-Compatible Designs PC100/PC133-compliant timing and 133 MHz clock capability make it suitable for designs adhering to those SDRAM timing profiles.
Unique Advantages
- Industrial Temperature Range: Rated –40°C to +85°C to support deployment in systems exposed to wider temperature variations.
- Standard SDRAM Compatibility: PC100/PC133 compliance and fully synchronous operation simplify integration with systems designed for standard SDRAM timing.
- Flexible Burst and Refresh Options: Programmable burst lengths and auto/self-refresh modes enable designers to optimize throughput and power behavior for different workloads.
- Single 3.3 V Supply: Operation from a single 3.0 V–3.6 V supply streamlines power-rail design on the host PCB.
- Compact Surface-Mount Package: 54-pin TSOP II package provides a compact footprint for board-level memory expansion while maintaining standard pinout conventions.
Why Choose MT48LC8M16A2P-75 IT:G TR?
The MT48LC8M16A2P-75 IT:G TR delivers a practical SDRAM solution for systems requiring 128 Mbit of volatile, synchronous parallel memory with PC100/PC133-compatible timing. Its industrial temperature rating, single 3.3 V supply, and standard TSOP II packaging make it suitable for embedded and industrial designs where proven SDRAM behavior and predictable timing are required.
This device is well suited to designers and procurement teams seeking a straightforward, board-mountable SDRAM option for memory expansion and legacy timing compatibility, offering a balance of integration simplicity and operational stability across a wide temperature range.
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