MT48LC8M16A2P-7E:L TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 165 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC8M16A2P-7E:L TR – IC DRAM 128MBIT PAR 54TSOP II

The MT48LC8M16A2P-7E:L TR is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface. It operates with a 133 MHz clock and 5.4 ns access time, making it suitable for systems that require PC100/PC133-compatible SDRAM timing and standard commercial temperature operation.

This device is designed for integration in applications needing a 3.3 V supply (3.0 V–3.6 V), LVTTL-compatible I/O, and a compact 54-pin TSOP II (0.400", 10.16 mm width) package.

Key Features

  • Memory Architecture  The device is organized as 8M × 16 (128 Mbit) with four internal banks to optimize row/column operations and hide row access/precharge latency.
  • SDRAM Core  Fully synchronous operation with all signals registered on the positive edge of the system clock and internal pipelined operation allowing column address changes every clock cycle.
  • Performance  PC100- and PC133-compliant timing; specified for 133 MHz clock frequency and 5.4 ns access time for the -7E speed grade.
  • Burst and Refresh  Programmable burst lengths (1, 2, 4, 8 or full page) plus Auto Precharge, Concurrent Auto Precharge, Auto Refresh modes, and a 64 ms / 4,096-cycle refresh scheme.
  • Low-Power and Self-Refresh  Supports Self Refresh Mode with both standard and low-power options, indicated in the datasheet options.
  • Interface and Signaling  LVTTL-compatible inputs and outputs for standard 3.3 V system interfacing; single +3.3 V ±0.3 V supply.
  • Package and Mounting  Supplied in a 54-pin TSOP II (400 mil) package suitable for surface-mount assembly; package width 10.16 mm.
  • Operating Range  Commercial temperature grade specified for 0°C to +70°C (TA).

Typical Applications

  • PC-Compatible Memory Subsystems  Suitable for designs targeting PC100/PC133 timing requirements where standard SDRAM timing compatibility is required.
  • Embedded System Memory  Use as parallel SDRAM for embedded platforms requiring 128 Mbit density and LVTTL I/O at 3.3 V supply.
  • Board-Level SDRAM Expansion  Compact 54-TSOP II package supports board-level integration where board space and standard commercial temperature operation are design constraints.

Unique Advantages

  • Verified PC100/PC133 Timing: The -7E speed grade and 133 MHz clock rating provide compatibility with systems designed around PC100/PC133 SDRAM timing.
  • Flexible Burst Control: Programmable burst lengths (including full-page) enable designers to tune throughput and latency to match memory access patterns.
  • Power Management Options: Self Refresh and low-power modes reduce standby power and support systems that require power-aware memory behavior.
  • Compact Surface-Mount Package: 54-pin TSOP II (0.400", 10.16 mm) simplifies PCB routing and assembly for space-constrained designs.
  • Standard Voltage and I/O: Single +3.3 V ±0.3 V supply and LVTTL-compatible I/O ease integration into common 3.3 V platforms.

Why Choose IC DRAM 128MBIT PAR 54TSOP II?

The MT48LC8M16A2P-7E:L TR provides a straightforward, standards-aligned SDRAM solution for designs that require 128 Mbit density, PC100/PC133 timing support, and a compact TSOP II package. Its combination of internal banking, programmable burst lengths, and self-refresh options address common performance and power-management needs in commercial-temperature systems.

This device is appropriate for engineers and procurement teams specifying parallel SDRAM for embedded platforms, PC-compatible memory subsystems, or board-level expansions where 3.3 V operation, LVTTL I/O, and a 54-pin TSOP II footprint are required. Its documented timing and refresh behavior support predictable integration into existing SDRAM memory controllers.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the MT48LC8M16A2P-7E:L TR.

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