MT48LC8M16A2TG-6A:G TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 259 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC8M16A2TG-6A:G TR – 128 Mbit SDRAM (8M × 16) 54‑TSOP II

The MT48LC8M16A2TG-6A:G TR is a 128 Mbit volatile SDRAM organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous SDR SDRAM architecture with internal pipelining and banked memory to support high-throughput, clocked operation.

This device is intended for systems that require a 128 Mbit parallel SDRAM component operating from a 3.0 V to 3.6 V supply, with a commercial operating temperature range of 0 °C to 70 °C and a 400 mil (10.16 mm) wide 54‑TSOP II package.

Key Features

  • Memory Technology  SDR SDRAM; fully synchronous operation with all signals registered on the positive edge of the system clock.
  • Memory Organization  8M × 16 configuration (128 Mbit) with four internal banks for improved access concurrency and hidden row precharge.
  • Performance  Clock frequency up to 167 MHz (speed grade -6A) with an access time listed as 5.4 ns and timing options supporting CL and RCD/RP parameters.
  • Programmable Burst and Refresh  Programmable burst lengths of 1, 2, 4, 8 or full page; supports auto refresh and self‑refresh modes (standard and low power options noted in device documentation).
  • Interface and Compatibility  Parallel memory interface with LVTTL‑compatible inputs and outputs; PC100 and PC133 compliance is indicated in the device feature set.
  • Power  Single 3.3 V ±0.3 V supply (3.0 V to 3.6 V specified) suitable for standard 3.3 V system rails.
  • Package and Temperature  54‑pin TSOP II (0.400" / 10.16 mm width) plastic package; commercial operating range 0 °C to +70 °C (TA).

Typical Applications

  • Parallel memory subsystems  Used as a 128 Mbit SDRAM component where parallel SDRAM density and synchronous operation are required.
  • System memory expansion  Suitable for designs that need an external SDRAM device with 8M × 16 organization and standard 3.3 V power.
  • Clocked data buffering  Employed in applications leveraging pipelined operation and internal banks to manage row access and precharge sequences.

Unique Advantages

  • High-density 8M × 16 organization: Provides 128 Mbit in a single 54‑pin TSOP II component to simplify board-level memory implementation.
  • Synchronous, pipelined architecture: All signals registered on the positive clock edge and internal pipelining enable predictable timing and clocked transfers.
  • Flexible burst and refresh control: Programmable burst lengths and auto/self‑refresh support allow tuning for different memory access patterns and power scenarios.
  • Standard 3.3 V operation: Operates from a 3.0 V to 3.6 V supply (3.3 V ±0.3 V), facilitating integration into common 3.3 V systems.
  • Compact TSOP II package: 54‑pin, 400 mil TSOP II package offers a space-efficient footprint for board designs requiring through‑board parallel DRAM.

Why Choose IC DRAM 128MBIT PAR 54TSOP II?

The MT48LC8M16A2TG-6A:G TR positions itself as a straightforward, standards‑based 128 Mbit SDRAM solution for designs needing synchronous, parallel memory with pipelined operation and internal banking. Its 8M × 16 organization, programmable burst options, and support for PC100/PC133 timing profiles make it a suitable candidate where a discrete SDRAM device is required.

This device is well suited to engineers and procurement teams looking for a commercially rated SDRAM device in a compact 54‑TSOP II package, offering predictable timing, standard 3.3 V power operation, and built‑in refresh and self‑refresh modes documented in the device specifications.

Request a quote or contact sales to check availability, lead times, and pricing for MT48LC8M16A2TG-6A:G TR.

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