MT48LC8M16A2TG-6A:G TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 259 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2TG-6A:G TR – 128 Mbit SDRAM (8M × 16) 54‑TSOP II
The MT48LC8M16A2TG-6A:G TR is a 128 Mbit volatile SDRAM organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous SDR SDRAM architecture with internal pipelining and banked memory to support high-throughput, clocked operation.
This device is intended for systems that require a 128 Mbit parallel SDRAM component operating from a 3.0 V to 3.6 V supply, with a commercial operating temperature range of 0 °C to 70 °C and a 400 mil (10.16 mm) wide 54‑TSOP II package.
Key Features
- Memory Technology SDR SDRAM; fully synchronous operation with all signals registered on the positive edge of the system clock.
- Memory Organization 8M × 16 configuration (128 Mbit) with four internal banks for improved access concurrency and hidden row precharge.
- Performance Clock frequency up to 167 MHz (speed grade -6A) with an access time listed as 5.4 ns and timing options supporting CL and RCD/RP parameters.
- Programmable Burst and Refresh Programmable burst lengths of 1, 2, 4, 8 or full page; supports auto refresh and self‑refresh modes (standard and low power options noted in device documentation).
- Interface and Compatibility Parallel memory interface with LVTTL‑compatible inputs and outputs; PC100 and PC133 compliance is indicated in the device feature set.
- Power Single 3.3 V ±0.3 V supply (3.0 V to 3.6 V specified) suitable for standard 3.3 V system rails.
- Package and Temperature 54‑pin TSOP II (0.400" / 10.16 mm width) plastic package; commercial operating range 0 °C to +70 °C (TA).
Typical Applications
- Parallel memory subsystems Used as a 128 Mbit SDRAM component where parallel SDRAM density and synchronous operation are required.
- System memory expansion Suitable for designs that need an external SDRAM device with 8M × 16 organization and standard 3.3 V power.
- Clocked data buffering Employed in applications leveraging pipelined operation and internal banks to manage row access and precharge sequences.
Unique Advantages
- High-density 8M × 16 organization: Provides 128 Mbit in a single 54‑pin TSOP II component to simplify board-level memory implementation.
- Synchronous, pipelined architecture: All signals registered on the positive clock edge and internal pipelining enable predictable timing and clocked transfers.
- Flexible burst and refresh control: Programmable burst lengths and auto/self‑refresh support allow tuning for different memory access patterns and power scenarios.
- Standard 3.3 V operation: Operates from a 3.0 V to 3.6 V supply (3.3 V ±0.3 V), facilitating integration into common 3.3 V systems.
- Compact TSOP II package: 54‑pin, 400 mil TSOP II package offers a space-efficient footprint for board designs requiring through‑board parallel DRAM.
Why Choose IC DRAM 128MBIT PAR 54TSOP II?
The MT48LC8M16A2TG-6A:G TR positions itself as a straightforward, standards‑based 128 Mbit SDRAM solution for designs needing synchronous, parallel memory with pipelined operation and internal banking. Its 8M × 16 organization, programmable burst options, and support for PC100/PC133 timing profiles make it a suitable candidate where a discrete SDRAM device is required.
This device is well suited to engineers and procurement teams looking for a commercially rated SDRAM device in a compact 54‑TSOP II package, offering predictable timing, standard 3.3 V power operation, and built‑in refresh and self‑refresh modes documented in the device specifications.
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