MT48LC8M16A2TG-75 IT:G TR

The MT48LC8M16A2TG-75 IT:G TR is a 128 Mbit SDRAM organized as 8M × 16 with a parallel memory interface in a 54‑pin TSOP II package. It implements fully synchronous SDR SDRAM architecture and is targeted at systems requiring PC100/PC133‑class synchronous DRAM performance with industrial temperature operation.

Key operational characteristics include a 133 MHz clock frequency, 3.0 V–3.6 V single supply, fast access times, internal pipelined operation and internal bank architecture to support efficient burst and pipelined memory access patterns.

Key Features

• Core / Architecture  Fully synchronous SDR SDRAM organized as 8M × 16 with four internal banks to support pipelined operation and concurrent row access/precharge handling.
• Memory Capacity & Organization  128 Mbit total capacity presented as 8M × 16, suitable for parallel DRAM memory subsystems.
• Performance  PC100‑ and PC133‑compliant timing options with a clock frequency of 133 MHz and an access time specified at 5.4 ns. Programmable burst lengths (1, 2, 4, 8, or full page).
• Timing and Cycle  Target timing grades include 3‑3‑3 and 2‑2‑2 CAS latencies; write cycle time (word/page) is 15 ns for the specified device.
• Power  Single 3.3 V ±0.3 V supply range (3.0 V–3.6 V) with standard and low‑power self‑refresh modes noted in device options.
• Interfaces & I/O  LVTTL‑compatible inputs and outputs with all signals registered on the positive edge of the system clock to maintain synchronous operation.
• System Reliability  Auto refresh (4K cycle refresh), auto precharge and selectable refresh modes to maintain data integrity during normal and low‑power operation.
• Package & Temperature  54‑pin TSOP II (400 mil, 10.16 mm width) plastic package with industrial operating temperature range of –40°C to +85°C.

Typical Applications

• Industrial Control Systems  Provides synchronous parallel DRAM capacity for control and data buffering in equipment operating across –40°C to +85°C.
• Embedded Memory Subsystems  Acts as a compact SDRAM device for embedded boards requiring PC100/PC133 timing and a 54‑pin TSOP II footprint.
• System Memory Buffers  Supports high‑rate burst transfers and pipelined access patterns for buffer and working memory roles in electronic systems.

Unique Advantages

• Industry‑standard timing compatibility: PC100 and PC133 compliance ensures predictable integration into systems designed around these SDRAM timing classes.
• High‑speed synchronous operation: 133 MHz clock frequency and programmable CAS latency options enable flexible performance tuning for target system requirements.
• Industrial temperature rating: –40°C to +85°C operation supports deployment in temperature‑challenging environments.
• Compact TSOP II packaging: 54‑pin TSOP II (0.400", 10.16 mm width) provides a dense, board‑level footprint for space‑constrained designs.
• Single 3.3 V supply: 3.0 V–3.6 V operation simplifies power rail design while supporting standard LVTTL I/O levels.
• Built‑in refresh and power features: Auto refresh, auto precharge and self‑refresh options help maintain data integrity and support low‑power modes.

Why Choose MT48LC8M16A2TG-75 IT:G TR?

The MT48LC8M16A2TG-75 IT:G TR delivers a compact 128 Mbit SDRAM solution with PC100/PC133 synchronous operation, flexible timing options and industrial temperature capability. Its 8M × 16 organization, internal pipelined banks and programmable burst lengths make it suitable for systems that require predictable parallel SDRAM performance and efficient burst transfers.

This device is appropriate for designers seeking a proven SDRAM building block in a 54‑pin TSOP II package, supporting 3.3 V supply systems and operating across extended temperature ranges for robust field deployment.

Request a quote or submit a request for pricing and availability to get more information and lead‑time for the MT48LC8M16A2TG-75 IT:G TR.