MT48LC8M16A2P-7E:G TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 670 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2P-7E:G TR – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC8M16A2P-7E:G TR is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with four internal banks and a parallel memory interface. It implements fully synchronous, pipelined SDR SDRAM architecture and targets systems requiring 128 Mbit of volatile parallel DRAM in a 54-pin TSOP II package.
Key operational parameters include a 133 MHz clock frequency, 3.0 V–3.6 V supply range, commercial operating temperature of 0 °C to 70 °C, and fast timing characteristics suitable for PC100/PC133-class designs and similar parallel SDRAM applications.
Key Features
- Memory Architecture 128 Mbit SDRAM organized as 8M × 16 with four internal banks for improved row/column management and concurrent operations.
- SDR SDRAM Core Fully synchronous operation with registered signals on the positive clock edge and internal pipelined operation allowing column address changes every clock cycle.
- Performance & Timing PC100- and PC133-compliant timing options with a 133 MHz clock frequency, specified access time of 5.4 ns, and a write cycle/word page time of 14 ns.
- Programmable Burst & Refresh Programmable burst lengths (1, 2, 4, 8, or full page) plus auto precharge and auto refresh modes; supports standard self-refresh modes.
- Power & I/O Single-supply operation in the 3.0 V–3.6 V range and LVTTL-compatible inputs and outputs for interface compatibility with common 3.3 V logic.
- Package & Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package with a commercial operating temperature range of 0 °C to +70 °C.
Typical Applications
- PC100/PC133 memory modules Suitable for use in designs and systems targeting PC100/PC133 compliant SDRAM timing.
- Embedded systems with parallel SDRAM Provides 128 Mbit volatile storage for embedded platforms requiring a parallel SDRAM interface in a compact TSOP II package.
- Commercial electronic equipment Fits applications operating in the commercial temperature range (0 °C to 70 °C) that require synchronous DRAM buffering or main memory.
Unique Advantages
- PC100/PC133 timing compatibility: Enables integration into systems designed around PC100 and PC133 SDRAM timing standards.
- Flexible data transfer options: Programmable burst lengths and pipelined operation allow designers to optimize throughput for varied access patterns.
- Compact TSOP II packaging: 54-pin, 0.400" (10.16 mm) width package reduces board footprint while providing standard parallel DRAM pinout.
- Single 3.3 V supply: Operates from a 3.0 V–3.6 V supply range, simplifying power design for 3.3 V systems.
- Internal bank architecture: Four internal banks and internal precharge/refresh features help hide row access times and improve effective memory throughput.
- Commercial temperature rating: Specified for 0 °C to +70 °C operation for stable performance in commercial-grade applications.
Why Choose MT48LC8M16A2P-7E:G TR?
The MT48LC8M16A2P-7E:G TR delivers a straightforward, verified 128 Mbit SDRAM solution with PC100/PC133 timing compatibility, flexible burst modes, and a compact 54-pin TSOP II footprint. Its combination of synchronous pipelined operation, internal bank architecture, and LVTTL-compatible I/O makes it appropriate for designs that require predictable parallel SDRAM behavior and compact board integration.
This device is well suited to engineers and procurement teams sourcing commercial-temperature parallel SDRAM for legacy and contemporary systems that operate from a 3.0 V–3.6 V supply and require 128 Mbit volatile storage with standard SDRAM control and refresh features.
Request a quote or submit an inquiry for availability and pricing for MT48LC8M16A2P-7E:G TR to evaluate this SDRAM device for your next design.