MT53D1G64D8SQ-053 WT ES:E TR

IC DRAM 64GBIT 1.866GHZ 556VFBGA
Part Description

IC DRAM 64GBIT 1.866GHZ 556VFBGA

Quantity 743 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package556-VFBGA (12.4x12.4)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging556-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 64
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT53D1G64D8SQ-053 WT ES:E TR – IC DRAM 64GBIT 1.866GHZ 556VFBGA

The MT53D1G64D8SQ-053 WT ES:E TR is a 64 Gbit volatile DRAM device based on SDRAM - Mobile LPDDR4 technology. It provides a 1G x 64 memory organization and a 1.866 GHz clock frequency targeted at designs requiring Mobile LPDDR4 memory in a compact 556-VFBGA package.

Key attributes include a 1.1V supply and an operating temperature range of -30°C ~ 85°C (TC), making the device suitable for systems that need high-density LPDDR4 memory within those electrical and environmental parameters.

Key Features

  • Memory Core SDRAM - Mobile LPDDR4 technology with a total capacity of 64 Gbit and a memory organization of 1G x 64.
  • Clock Frequency Rated for operation at 1.866 GHz to meet the timing requirements associated with the specified LPDDR4 clocking.
  • Power Single voltage supply of 1.1V consistent with Mobile LPDDR4 signaling and power domains.
  • Package 556-VFBGA package with package notation (12.4x12.4) suitable for board-level integration in space-constrained assemblies.
  • Memory Format & Mounting Volatile DRAM memory format intended for surface-mounted applications.
  • Operating Temperature Specified temperature range of -30°C ~ 85°C (TC) for device operation.

Typical Applications

  • Mobile devices and platforms — Use where Mobile LPDDR4 SDRAM is required to provide high-density volatile memory in mobile-oriented system designs.
  • Memory module integration — Suitable for modules or subsystems that integrate 64 Gbit LPDDR4 devices in a 556-VFBGA footprint.
  • Embedded systems with constrained board area — Provides a compact, high-density DRAM option for space-limited embedded designs operating within the specified temperature range.

Unique Advantages

  • High memory density: 64 Gbit capacity and 1G x 64 organization enable compact implementations of large volatile memory.
  • Mobile LPDDR4 architecture: SDRAM - Mobile LPDDR4 technology aligns with LPDDR4 system designs and related signaling domains.
  • Specified clock performance: 1.866 GHz clock frequency supports the timing characteristics expected of the device.
  • Low-voltage operation: 1.1V supply supports designs targeting LPDDR4 voltage domains.
  • Compact package: 556-VFBGA (12.4x12.4) package enables dense board-level placement.
  • Extended operating range: -30°C ~ 85°C (TC) rating covers a range of operating environments.

Why Choose IC DRAM 64GBIT 1.866GHZ 556VFBGA?

This Micron-manufactured LPDDR4 DRAM device combines 64 Gbit capacity, a 1G x 64 organization, and a 1.866 GHz clock frequency in a 556-VFBGA (12.4x12.4) package with a 1.1V supply and a -30°C ~ 85°C (TC) operating range. Its specifications align with designs that require Mobile LPDDR4 memory density and compatible electrical characteristics.

The device is appropriate for system designers and module integrators seeking a compact, high-density volatile memory component for LPDDR4-based platforms where the listed operating temperature and supply voltage meet system requirements.

Request a quote or contact sales to discuss availability, pricing, and how this MT53D1G64D8SQ-053 WT ES:E TR device can fit your LPDDR4 memory design requirements.

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