MT53D2048M32D8QD-053 WT ES:D
| Part Description |
IC DRAM 64GBIT 1.866GHZ FBGA |
|---|---|
| Quantity | 1,127 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 2G x 32 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT53D2048M32D8QD-053 WT ES:D – IC DRAM 64GBIT 1.866GHZ FBGA
The MT53D2048M32D8QD-053 WT ES:D is a 64 Gbit volatile DRAM device implemented as mobile LPDDR4 SDRAM. It is organized as 2G × 32 and is specified for operation with a 1.866 GHz clock frequency and a 1.1 V supply.
This device targets designs that require high-density, low-voltage mobile SDRAM with defined thermal range support from −30°C to 85°C, offering a compact FBGA form factor for space-constrained implementations.
Key Features
- Memory Type & Architecture Mobile LPDDR4 SDRAM implemented as volatile DRAM with a 64 Gbit density organized as 2G × 32.
- Clock Frequency Supports a 1.866 GHz clock frequency for timing and throughput requirements aligned with the device specification.
- Supply Voltage Operates at a 1.1 V supply voltage, consistent with low-voltage mobile memory applications.
- Temperature Range Specified operating temperature from −30°C to 85°C (TC) for deployment across a range of environmental conditions.
- Form Factor Supplied in an FBGA package as indicated by the product name for compact board-level integration.
- Memory Size & Organization 64 Gbit total capacity with a 2G × 32 organization to match 32-bit data interfaces.
Typical Applications
- Mobile and portable electronics Provides high-density LPDDR4 memory suited to space-constrained handheld and portable systems.
- Embedded systems Serves as system memory where low-voltage, high-capacity DRAM is required for application runtime data.
- High-density memory subsystems Useful in designs requiring 64 Gbit capacity and 32-bit organization for memory subsystem scaling.
Unique Advantages
- High-density memory: 64 Gbit capacity allows consolidation of large memory requirements into a single device.
- Defined high-speed operation: Specified support for a 1.866 GHz clock frequency enables timing consistent with the device specification.
- Low-voltage operation: 1.1 V supply reduces power domain requirements for mobile and low-power designs.
- Compact FBGA package: Package choice supports compact board layouts and high integration density.
- Wide operating temperature: −30°C to 85°C operating range supports deployment across varied thermal environments.
- Clear memory organization: 2G × 32 organization aligns with 32-bit data paths for straightforward system integration.
Why Choose MT53D2048M32D8QD-053 WT ES:D?
The MT53D2048M32D8QD-053 WT ES:D combines 64 Gbit LPDDR4 density with a 1.866 GHz clock specification and 1.1 V operation, making it suited to designs that require compact, low-voltage, high-density DRAM. Its 2G × 32 organization and FBGA form factor support integration into space-constrained and memory-dense systems.
This part is appropriate for engineers and designers building mobile and embedded platforms that need verifiable memory capacity, defined operating frequency, and temperature support. Its specification set provides a clear basis for system-level memory planning and long-term design consistency.
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