MT53D2048M32D8QD-053 WT ES:D

IC DRAM 64GBIT 1.866GHZ FBGA
Part Description

IC DRAM 64GBIT 1.866GHZ FBGA

Quantity 1,127 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization2G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D2048M32D8QD-053 WT ES:D – IC DRAM 64GBIT 1.866GHZ FBGA

The MT53D2048M32D8QD-053 WT ES:D is a 64 Gbit volatile DRAM device implemented as mobile LPDDR4 SDRAM. It is organized as 2G × 32 and is specified for operation with a 1.866 GHz clock frequency and a 1.1 V supply.

This device targets designs that require high-density, low-voltage mobile SDRAM with defined thermal range support from −30°C to 85°C, offering a compact FBGA form factor for space-constrained implementations.

Key Features

  • Memory Type & Architecture  Mobile LPDDR4 SDRAM implemented as volatile DRAM with a 64 Gbit density organized as 2G × 32.
  • Clock Frequency  Supports a 1.866 GHz clock frequency for timing and throughput requirements aligned with the device specification.
  • Supply Voltage  Operates at a 1.1 V supply voltage, consistent with low-voltage mobile memory applications.
  • Temperature Range  Specified operating temperature from −30°C to 85°C (TC) for deployment across a range of environmental conditions.
  • Form Factor  Supplied in an FBGA package as indicated by the product name for compact board-level integration.
  • Memory Size & Organization  64 Gbit total capacity with a 2G × 32 organization to match 32-bit data interfaces.

Typical Applications

  • Mobile and portable electronics  Provides high-density LPDDR4 memory suited to space-constrained handheld and portable systems.
  • Embedded systems  Serves as system memory where low-voltage, high-capacity DRAM is required for application runtime data.
  • High-density memory subsystems  Useful in designs requiring 64 Gbit capacity and 32-bit organization for memory subsystem scaling.

Unique Advantages

  • High-density memory:  64 Gbit capacity allows consolidation of large memory requirements into a single device.
  • Defined high-speed operation:  Specified support for a 1.866 GHz clock frequency enables timing consistent with the device specification.
  • Low-voltage operation:  1.1 V supply reduces power domain requirements for mobile and low-power designs.
  • Compact FBGA package:  Package choice supports compact board layouts and high integration density.
  • Wide operating temperature:  −30°C to 85°C operating range supports deployment across varied thermal environments.
  • Clear memory organization:  2G × 32 organization aligns with 32-bit data paths for straightforward system integration.

Why Choose MT53D2048M32D8QD-053 WT ES:D?

The MT53D2048M32D8QD-053 WT ES:D combines 64 Gbit LPDDR4 density with a 1.866 GHz clock specification and 1.1 V operation, making it suited to designs that require compact, low-voltage, high-density DRAM. Its 2G × 32 organization and FBGA form factor support integration into space-constrained and memory-dense systems.

This part is appropriate for engineers and designers building mobile and embedded platforms that need verifiable memory capacity, defined operating frequency, and temperature support. Its specification set provides a clear basis for system-level memory planning and long-term design consistency.

Request a quote or submit an inquiry to discuss pricing and availability for MT53D2048M32D8QD-053 WT ES:D.

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