MT53D2048M32D8QD-062 WT ES:D

IC DRAM 64GBIT 1.6GHZ FBGA
Part Description

IC DRAM 64GBIT 1.6GHZ FBGA

Quantity 591 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.6 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization2G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D2048M32D8QD-062 WT ES:D – IC DRAM 64GBIT 1.6GHZ FBGA

The MT53D2048M32D8QD-062 WT ES:D is a 64 Gbit volatile DRAM device using SDRAM Mobile LPDDR4 technology. It is organized as 2G × 32 and operates at a clock frequency of 1.6 GHz with a nominal supply voltage of 1.1 V.

Targeted at mobile memory applications, the device combines high density and high-speed operation with low-voltage operation and an operating temperature range of −30°C to 85°C to address designs that require compact, power-conscious memory solutions.

Key Features

  • Technology — Mobile LPDDR4 SDRAM  Implements Mobile LPDDR4 SDRAM technology appropriate for mobile-oriented memory architectures.
  • Memory Capacity and Organization  64 Gbit total capacity organized as 2G × 32 to support high-density memory configurations.
  • High Clock Frequency  Operates at 1.6 GHz to support higher-bandwidth memory transfers.
  • Low-Voltage Operation  1.1 V supply voltage for reduced power consumption in low-power systems.
  • Operating Temperature Range  Specified for operation from −30°C to 85°C to accommodate extended ambient conditions.
  • Memory Type & Format  Volatile DRAM in LPDDR4 format for transient system memory applications.

Typical Applications

  • Mobile devices  Mobile LPDDR4 technology and 64 Gbit capacity make it suitable for memory subsystems in mobile computing and handheld devices.
  • Portable electronics  Low-voltage 1.1 V operation and high clock frequency support power-sensitive portable product designs.
  • High-density memory modules  2G × 32 organization enables integration into compact, high-capacity memory modules and subsystems.

Unique Advantages

  • High-density 64 Gbit capacity: Enables large memory footprints in space-constrained designs.
  • 1.6 GHz clock performance: Supports higher-bandwidth memory operations where throughput is required.
  • Low-voltage 1.1 V operation: Helps reduce system power consumption in battery-powered applications.
  • Mobile LPDDR4 architecture: Aligns with mobile memory design paradigms for integration into mobile-focused systems.
  • Extended temperature range: −30°C to 85°C rating broadens usable environmental conditions.

Why Choose IC DRAM 64GBIT 1.6GHZ FBGA?

The IC DRAM 64GBIT 1.6GHZ FBGA (MT53D2048M32D8QD-062 WT ES:D) offers a combination of high density, high clock speed, and low-voltage operation in a Mobile LPDDR4 DRAM device manufactured by Micron Technology Inc. It is positioned for designs that require 64 Gbit of volatile memory with 1.6 GHz operation and a wide operating temperature range.

This device is suited for engineers developing mobile and portable systems who need a compact, power-conscious memory component. Its specifications support straightforward integration into memory subsystems where capacity, bandwidth, and low-voltage operation are primary design drivers.

Request a quote or submit an inquiry to discuss availability and pricing for the MT53D2048M32D8QD-062 WT ES:D.

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