TC58NVG5H2HTAI0
| Part Description |
32GB SLC NAND |
|---|---|
| Quantity | 836 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of TC58NVG5H2HTAI0 – 32GB SLC NAND
The TC58NVG5H2HTAI0 is a 32 Gbit SLC NAND flash memory device implementing single-level-cell (SLC) NAND architecture in a parallel memory interface. It is supplied in a 48-TFSOP / 48-TSOP I package and is organized as 4G × 8 bits, providing non-volatile storage for embedded and industrial applications.
Designed for systems that require reliable flash storage across a wide ambient range, the device combines SLC NAND technology with package options and an operating temperature rating suitable for -40°C to 85°C environments.
Key Features
- Memory Type & Capacity 32 Gbit SLC NAND flash memory organized as 4G × 8 bits for parallel access and non-volatile storage.
- Technology FLASH - NAND (SLC) technology; SLC stores one bit per cell as defined in the product documentation.
- Interface Parallel memory interface for direct bus access in host systems.
- Package & Mounting Available in a 48-TFSOP (0.724", 18.40 mm width) / 48-TSOP I package suitable for surface-mount assembly.
- Operating Temperature Rated for operation from -40°C to 85°C to support a broad range of commercial and industrial ambient conditions.
- Memory Format FLASH memory format for persistent data retention without power.
- Performance and Endurance (Datasheet Note) The datasheet references high read/write performance and write endurance typical of SLC NAND devices.
Typical Applications
- Solid-State Drives (SSDs) Use as raw NAND storage in SSD controllers and embedded storage subsystems.
- Memory Cards Suitable for integration into removable or embedded memory card solutions requiring SLC flash.
- Industrial Equipment Persistent storage for industrial controllers and machinery where wide temperature operation is required.
- Embedded Storage On-board non-volatile storage for embedded platforms that use parallel NAND interfaces.
Unique Advantages
- SLC Architecture: Single-level-cell design stores one bit per memory cell, as specified in the datasheet, providing predictable cell behavior and data representation.
- Wide Operating Range: Rated for -40°C to 85°C operation, enabling deployment in many commercial and industrial environments.
- Standard Parallel Interface: Parallel memory organization (4G × 8) simplifies integration with controllers and legacy bus architectures.
- Compact TSOP Packaging: 48-TFSOP / 48-TSOP I package supports surface-mount assembly and compact PCB layouts.
- Documented Performance and Endurance: Datasheet references indicate SLC NAND's read/write performance and write endurance characteristics relevant to system design tradeoffs.
Why Choose TC58NVG5H2HTAI0?
The TC58NVG5H2HTAI0 positions itself as a straightforward SLC NAND solution for designs needing non-volatile parallel flash storage with a 32 Gbit capacity. Its 4G × 8 organization, TSOP packaging, and -40°C to 85°C rating make it suitable for embedded and industrial applications where proven SLC behavior and predictable memory characteristics are desired.
Designers and procurement teams seeking a parallel-interface SLC NAND option can leverage the device's documented SLC technology and package form factor to streamline integration, support product longevity, and align with system thermal requirements.
Request a quote or contact sales to discuss availability, lead times, and suitability for your specific design requirements.