THGBMUG8C2LBAIL

The THGBMUG8C2LBAIL is a managed e‑MMC flash memory device integrating NAND flash and an e‑MMC controller in a single 153‑ball BGA package. It provides a 256 Gbit (32G × 8) non‑volatile storage solution with an e‑MMC 5.1 interface for embedded applications.

Designed for compact embedded systems, this device delivers on‑board management features such as error correction and wear leveling while operating from a single 2.7–3.6 V supply and an operating temperature range of −20°C to 85°C.

Key Features

• Memory Core 256 Gbit NAND flash organized as 32G × 8, providing high‑density non‑volatile storage in a single device.
• Managed e‑MMC Architecture Integrates KIOXIA e‑MMC controller with flash to provide on‑board error correction, wear leveling, logical‑to‑physical address translation and bad‑block management.
• Interface JEDEC e‑MMC v5.1 compliant interface for host connectivity; supports the e‑MMC v5.1 feature set as defined in the product brief.
• Performance Supports a clock frequency of 200 MHz for the e‑MMC interface.
• Power Single supply range of 2.7 V to 3.6 V to match common embedded system power rails.
• Package 153‑ball BGA package (11.5 × 13 mm) that delivers a small footprint for space‑constrained designs.
• Reliability & Boot On‑board ECC and multiple boot partition support as part of the managed flash feature set.
• Operating Range Specified operating temperature range of −20°C to 85°C (TC).

Typical Applications

• IoT Devices Embedded storage for firmware, data logging and local content in compact IoT systems.
• Smartphones Managed flash storage for user data and system images where e‑MMC interfaces are supported.
• Smart TVs and Streaming Media Local content storage and system firmware hosting in consumer media devices.
• Tablets and 2‑in‑1 Devices Solid‑state removable storage alternative for systems using e‑MMC interfaces.
• Smart Speakers Persistent storage for voice models, configuration and media assets in voice‑enabled devices.

Unique Advantages

• Highly integrated managed memory: Combines KIOXIA controller and NAND flash in one package to offload flash management from the host.
• On‑board data integrity features: Built‑in error correction, bad‑block management and wear leveling to improve usable life and data reliability.
• JEDEC e‑MMC v5.1 compliance: Standardized interface simplifies SoC integration where e‑MMC support is available.
• Compact BGA footprint: 153‑ball 11.5 × 13 mm package minimizes board area for space‑constrained designs.
• Flexible power operation: 2.7 V to 3.6 V supply range for compatibility with common system rails.
• Wide operating temperature: −20°C to 85°C rating suitable for a range of commercial embedded environments.

Why Choose IC FLASH 256GBIT EMMC 153FBGA?

The THGBMUG8C2LBAIL positions itself as a compact, managed storage option that pairs high‑density NAND with on‑board controller functions to simplify host design and data management. Its e‑MMC 5.1 interface, integrated ECC and wear leveling make it suitable for embedded systems that require reliable, persistent storage without adding flash management complexity to the host.

This part is appropriate for designers and procurement teams targeting space‑constrained consumer and IoT products that need a standardized e‑MMC interface, controlled power supply range, and defined operating temperature limits. The integrated architecture and standardized package support straightforward BOM and mechanical planning.

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