UFS64G-CY14-02N01

The UFS64G-CY14-02N01 is a 64GB Universal Flash Storage (UFS) device implementing the UFS 3.1 interface in a single surface-mounted package. It integrates NAND flash (TLC) memory with an on-board UFS controller, delivering a compact, standards-based storage solution for embedded and mobile applications.

Designed for small form-factor systems that require high-speed serial transfers and low power operation, this device targets applications such as smartphones, tablets, VR/AR devices and high-definition video systems where a compact, interoperable storage option is needed.

Key Features

• Core & Memory: 512 Gbit total capacity organized as 64G × 8 using TLC NAND flash; integrated UFS controller and NAND in a single surface-mounted device.
• Interface: UFS 3.1 memory interface with a high-speed serial link utilising the MIPI Alliance M‑PHY interface as specified in Kingston documentation.
• Power & Voltage: Operates from a 2.4 V to 2.7 V supply range and includes on-device power-saving features noted in product literature.
• Clock: Specified clock frequency of 26 MHz for relevant control interfaces.
• Package & Mechanical: 153-ball VFBGA package (153-FBGA, 11.5 × 13 mm footprint) optimized for surface-mount assembly.
• Operating Temperature: Rated for an ambient range of -25°C to +85°C for use in temperature-variable environments.
• Standards & Integration: JEDEC-aligned UFS standard implementation to support broad host interoperability as described in manufacturer documentation.

Typical Applications

• Smartphones and Tablets — On-board high-density storage for mobile operating systems, apps and multimedia content where compact footprint and standards-based interface are required.
• Virtual and Augmented Reality Devices — Local storage for high-throughput content and assets in small-form-factor VR/AR headsets.
• High-Definition Video and Surveillance — Embedded storage for recording and playback in video conferencing, surveillance and streaming devices.
• PCs and Chromebooks — Integrated storage option for small-outline client systems requiring UFS interface compatibility.

Unique Advantages

• Integrated NAND and Controller: Single-package integration of TLC NAND and UFS controller simplifies board design and reduces component count.
• Standards-Based Interoperability: UFS 3.1 implementation and JEDEC-aligned design improve host compatibility across supported processors and platforms.
• Compact BGA Footprint: 153-ball VFBGA (11.5 × 13 mm) package minimizes board area for space-constrained devices.
• Wide Operating Temperature: -25°C to +85°C rating supports deployments across varied thermal environments.
• Low Voltage Operation: 2.4 V to 2.7 V supply reduces power domain complexity and supports low-power system designs.

Why Choose UFS 3.1 G4 2L 153B 64GB -25°C to 85°C?

The UFS64G-CY14-02N01 positions itself as a compact, standards-based storage module that combines NAND flash and a UFS controller in a single surface-mounted package. Its UFS 3.1 interface and M‑PHY serial link provide the protocol-level capability required for modern embedded and mobile storage use cases, while the 11.5 × 13 mm BGA package keeps board space requirements low.

This device is well suited for designers seeking a verified UFS storage component for small-form-factor systems—delivering a combination of integration, defined operating temperature range and supply voltage that supports robust, long-term deployment in consumer and embedded product lines.

Request a quote or submit an inquiry for pricing and availability to get product details and lead-time information for the UFS64G-CY14-02N01.