THGBMNG5D1LBAIL
| Part Description |
IC FLASH 32GBIT EMMC 153WFBGA |
|---|---|
| Quantity | 1,371 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMNG5D1LBAIL – IC FLASH 32GBIT eMMC 153-WFBGA
The THGBMNG5D1LBAIL is a 32 Gbit NAND flash memory device in the e•MMC™ series from Kioxia America, Inc. It implements a 4G x 8 organization with an eMMC memory interface and operates with a supply voltage range of 2.7 V to 3.6 V.
Packaged in a compact 153‑WFBGA (11.5 × 13 mm) and specified for an operating temperature range of -25°C to 85°C, this flash memory is suited for designs that require integrated eMMC storage with a 200 MHz clock interface.
Key Features
- Memory Type & Technology Non‑volatile NAND flash memory implemented as FLASH format for persistent data storage.
- Capacity & Organization 32 Gbit capacity organized as 4G × 8 for byte-wide data access and storage density.
- Interface eMMC memory interface for embedded storage integration in systems supporting eMMC.
- Clock Frequency 200 MHz clock frequency specification for timing reference in host interfaces.
- Voltage Supply Operates from 2.7 V to 3.6 V to match common embedded system power rails.
- Package 153‑WFBGA package (11.5 × 13 mm) to support compact board-level integration.
- Operating Temperature Rated for -25°C to 85°C (TA) for use across a wide range of ambient conditions.
- Manufacturer & Series Produced by Kioxia America, Inc. as part of the e•MMC™ series.
Typical Applications
- Embedded storage systems Use as onboard eMMC storage in embedded devices that require persistent NAND flash capacity.
- Consumer electronics Integration into compact consumer products that need a small‑footprint 32 Gbit eMMC solution.
- Industrial equipment Local storage for industrial controllers and instrumentation operating within the -25°C to 85°C range.
Unique Advantages
- Significant storage capacity: 32 Gbit density provides ample non‑volatile memory for firmware, files, and data logging.
- eMMC interface integration: Native eMMC interface simplifies connection to hosts designed for e•MMC™ devices.
- Compact packaging: 153‑WFBGA (11.5 × 13 mm) enables high‑density board layouts where space is constrained.
- Wide operating voltage range: 2.7 V to 3.6 V support for common embedded power domains.
- Extended ambient temperature range: Rated -25°C to 85°C to support deployment across varied environments.
Why Choose IC FLASH 32GBIT EMMC 153WFBGA?
The THGBMNG5D1LBAIL combines 32 Gbit NAND flash in an e•MMC™ interface within a compact 153‑WFBGA package, offering a straightforward embedded storage option for designs that require non‑volatile memory. Its electrical and thermal specifications—200 MHz clock reference, 2.7 V–3.6 V supply, and -25°C to 85°C operating range—make it suitable for a variety of system implementations where eMMC connectivity and moderate environmental tolerance are required.
This device targets engineers and procurement teams seeking a standardized eMMC memory component from Kioxia America, Inc., providing clear capacity, packaging, and electrical parameters for system-level planning and integration.
Request a quote or submit an inquiry for pricing and availability to evaluate THGBMNG5D1LBAIL for your next design project.