THGBMJG6C1LBAIL
| Part Description |
IC FLASH 64GBIT EMMC 153FBGA |
|---|---|
| Quantity | 1,617 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMJG6C1LBAIL – IC FLASH 64GBIT EMMC 153FBGA
The THGBMJG6C1LBAIL is a 64 Gbit non-volatile NAND flash memory delivered in an e•MMC™ format. It combines NAND flash storage with an embedded memory interface to provide integrated, removable-like storage for host systems.
This device is supplied in a 153-WFBGA package (11.5x13) and operates across a temperature range of -25°C to 85°C, making it suitable for designs that require compact, embedded flash memory with an eMMC interface.
Key Features
- Memory Type Non-volatile FLASH NAND memory providing persistent storage without power.
- Capacity 64 Gbit organized as 8G × 8 for high-density embedded storage.
- Interface eMMC memory interface for integrated host connectivity and simplified system integration.
- Package 153-WFBGA package (11.5x13) designed for compact board-level integration.
- Operating Temperature Rated for -25°C to 85°C (TA), supporting a wide ambient operating range.
- Memory Format Provided as FLASH with NAND technology for standard embedded storage architectures.
Typical Applications
- Embedded storage systems Use the eMMC interface and 64 Gbit FLASH capacity to provide onboard non-volatile storage for embedded devices.
- Compact module integration The 153-WFBGA (11.5x13) footprint enables high-density mounting where board space is constrained.
- Temperature-sensitive deployments Suitable for designs requiring operation across -25°C to 85°C ambient conditions.
Unique Advantages
- High-density storage: 64 Gbit capacity offers significant on-board non-volatile memory for data, firmware, or media storage needs.
- Integrated eMMC interface: Standard eMMC connectivity simplifies host integration and reduces system-level interface complexity.
- Compact package: 153-WFBGA (11.5x13) package supports space-constrained PCB layouts while providing robust connectivity.
- Wider operating range: Rated from -25°C to 85°C to accommodate a broad set of ambient conditions.
- Proven FLASH NAND technology: Non-volatile FLASH NAND memory provides persistent storage without external power.
Why Choose IC FLASH 64GBIT EMMC 153FBGA?
The THGBMJG6C1LBAIL positions itself as an integrated eMMC NAND flash option delivering 64 Gbit of non-volatile storage in a compact 153-WFBGA package. Its combination of eMMC interface, NAND FLASH format, and specified operating temperature range make it suitable for designs that require embedded, board-level storage with a standardized interface.
This part is appropriate for designers and procurement teams seeking a high-density, compact eMMC memory solution from Kioxia America, Inc., offering straightforward integration into systems that need persistent storage and a defined ambient operating range.
Request a quote or submit a quote inquiry to obtain pricing and availability for the THGBMJG6C1LBAIL e•MMC 64 Gbit FLASH device. Our team can provide further procurement details and lead-time information.
