THGBMHG8C4LBAWR

The THGBMHG8C4LBAWR is a 256 Gbit non-volatile NAND flash memory device delivered in an e•MMC memory interface. It combines NAND flash technology and an eMMC interface to provide embedded flash storage in a compact 153-WFBGA package.

This device targets designs that require high-density embedded flash with defined electrical and environmental envelopes, including a 2.7 V to 3.6 V supply range and an operating temperature range of −40°C to 85°C.

Key Features

• Memory Technology  NAND flash, provided as non-volatile storage in a FLASH memory format for persistent data retention.
• Memory Size & Organization  256 Gbit total capacity organized as 32G × 8, suitable for large embedded storage requirements.
• Interface  eMMC memory interface for embedded system integration.
• Clock Frequency  Supports a clock frequency of 52 MHz as specified for timing considerations.
• Voltage Supply  Operates from 2.7 V to 3.6 V, allowing compatibility with standard 3.3 V embedded power rails.
• Operating Temperature  Specified operating range of −40°C to 85°C (TA) for temperature-dependent deployment decisions.
• Package  Delivered in a 153-WFBGA (11.5 × 13 mm) package for compact board-level integration.
• Manufacturer  Manufactured by Kioxia America, Inc.

Typical Applications

• Embedded Storage  Use as onboard non-volatile storage in embedded systems that require eMMC-format flash memory.
• Consumer and Portable Devices  Integration into compact devices where 256 Gbit of NAND flash is needed in a small WFBGA package.
• Industrial Electronics  Deployment in equipment operating across −40°C to 85°C where a defined supply range (2.7 V to 3.6 V) and eMMC interface are required.

Unique Advantages

• High Density Storage:  256 Gbit capacity supports large firmware, application data, or multimedia storage within a single device.
• Standard eMMC Interface:  eMMC interface simplifies integration into systems designed for embedded memory modules.
• Defined Electrical Range:  2.7 V to 3.6 V supply range provides compatibility with common 3.3 V power domains.
• Wide Operating Temperature:  −40°C to 85°C rating supports deployment across a broad range of ambient conditions.
• Compact WFBGA Package:  153-WFBGA (11.5 × 13 mm) package reduces board area for space-constrained designs.
• Known Manufacturer:  Produced by Kioxia America, Inc., providing a traceable supply source for design planning.

Why Choose IC FLASH 256GBIT EMMC 153WFBGA?

The THGBMHG8C4LBAWR positions itself as a high-density NAND flash option with an eMMC interface, offering a balance of capacity, defined electrical characteristics, and a compact 153-WFBGA package. Its specified clock frequency, voltage range, and temperature rating make it a clear choice when these concrete parameters match design requirements.

This device is appropriate for designers and procurement teams seeking a 256 Gbit eMMC flash solution from Kioxia America, Inc., where board space, supply voltage compatibility, and operating temperature constraints are primary considerations.

If you require pricing, availability, or a formal quote for THGBMHG8C4LBAWR, request a quote or contact sales to discuss your requirements and lead times.