THGBMHG9C8LBAWG
| Part Description |
IC FLASH 512GBIT EMMC 153WFBGA |
|---|---|
| Quantity | 55 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMHG9C8LBAWG – IC FLASH 512GBIT eMMC 153WFBGA
The THGBMHG9C8LBAWG from Kioxia America, Inc. is a 512 Gbit non-volatile FLASH NAND memory device in the e•MMC™ series. It provides high-density embedded flash storage with a defined memory organization and an eMMC interface.
Key device specifics include a 64G × 8 memory organization, a 52 MHz clock frequency, an operating voltage range of 2.7 V to 3.6 V, and an operating temperature range of -40°C to 85°C, all packaged in a 153-WFBGA (11.5×13) supplier device package.
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND memory providing a total capacity of 512 Gbit.
- Memory Organization Organized as 64G × 8, supporting byte-wide memory organization.
- Interface & Clock eMMC memory interface with a specified 52 MHz clock frequency.
- Voltage Supply Wide supply range of 2.7 V to 3.6 V to match common system power rails.
- Operating Temperature Specified operating temperature range of -40°C to 85°C (TA).
- Package 153-WFBGA package case with supplier device package dimensions of 11.5×13 mm for compact board-level integration.
- Manufacturer & Series Part of the e•MMC™ series from Kioxia America, Inc., identified by part number THGBMHG9C8LBAWG.
Unique Advantages
- High-density storage: 512 Gbit capacity enables consolidation of large datasets on a single memory device.
- Defined memory architecture: 64G × 8 organization provides clear byte-wide memory mapping for system design.
- Standard eMMC interface: eMMC interface and a 52 MHz clock frequency support integration with hosts that accept eMMC devices.
- Flexible power envelope: 2.7 V to 3.6 V supply range allows operation across common system voltage rails.
- Extended temperature capability: Rated for operation from -40°C to 85°C (TA) to address environments within that range.
- Compact package footprint: 153-WFBGA (11.5×13) packaging supports high-density board layouts.
Why Choose IC FLASH 512GBIT EMMC 153WFBGA?
The IC FLASH 512GBIT EMMC 153WFBGA (THGBMHG9C8LBAWG) combines a high 512 Gbit NAND flash capacity with an eMMC interface, a 64G × 8 memory organization, and defined electrical and environmental specifications. Its supply voltage range (2.7 V–3.6 V), 52 MHz clock frequency, and -40°C to 85°C operating range make the device suitable for designs that require large non-volatile storage within those electrical and temperature limits.
With a compact 153-WFBGA (11.5×13) package and manufacturer support from Kioxia America, Inc., this device is positioned for use where a high-density eMMC flash component with the listed specifications is required.
Request a quote or submit a product inquiry to evaluate THGBMHG9C8LBAWG for your design requirements.
