THGBMHG8C4LBAU7

The THGBMHG8C4LBAU7 is a 256 Gbit non-volatile e•MMC flash memory device in a 153-WFBGA package. It combines NAND flash memory with an integrated controller and managed memory functions to provide a standardized, mass-storage solution for embedded designs.

Designed for industrial and consumer applications that require high-density, managed storage, this e•MMC device delivers standardized interface compatibility, on-chip memory management, and a broad operating range for deployments that demand robustness and straightforward integration.

Key Features

• Memory Density & Organization — 256 Gbit capacity arranged as 32G × 8 to support high-volume data storage within a compact footprint.
• Technology — NAND flash memory using 15 nm MLC technology and FLASH memory format for persistent data retention.
• Interface & Performance — eMMC interface with JEDEC compliance (JEDEC Version 5.0 / 5.1 indicated in product family) and high interface speed (HS400). Clock frequency specified at 200 MHz.
• Integrated Memory Management — On-board controller with error correction code (ECC), bad block management, wear-leveling and garbage collection to simplify host design and improve data integrity.
• Power & Voltage — Operates from a 2.7 V to 3.6 V supply range suitable for common embedded power rails.
• Package & Mechanical — 153-WFBGA package, 11.5 × 13 mm, providing a compact, ball-grid array footprint for surface-mount assembly.
• Temperature Range — Extended ambient operating temperature from -40°C to 105°C (TA) for use in temperature-challenging environments.

Typical Applications

• Industrial systems — Local mass storage for telemetry, logging and system firmware where extended temperature and managed storage are required.
• Consumer electronics — Embedded storage for multimedia devices and portable equipment requiring standardized e•MMC interface and high capacity.
• Multimedia devices — Storage for audio/video content and application data using managed NAND and high interface speeds.
• Smart metering & intelligent lighting — Reliable, non-volatile storage for firmware, logs and configuration data across varying operating temperatures.

Unique Advantages

• Managed, integrated storage: On-chip controller and memory management reduce host-side firmware complexity and BOM count.
• High-speed interface: HS400-capable e•MMC and a 200 MHz clock frequency support responsive data transfers for embedded multimedia and system storage.
• Data integrity features: ECC, bad block management and wear-leveling help maintain reliability over the device lifetime.
• Extended temperature performance: -40°C to 105°C operating range enables deployment in harsh or industrial environments.
• Compact package: 153-WFBGA (11.5 × 13 mm) offers high density in a space-efficient BGA footprint for surface-mount designs.
• Cost-effective mass storage: Part of an e•MMC product family positioned for efficient capacity-to-cost balance in embedded applications.

Why Choose IC FLASH 256GBIT EMMC 153WFBGA?

The THGBMHG8C4LBAU7 positions itself as a high-capacity, managed e•MMC storage device that balances performance, integration and reliability for embedded systems. Its combination of a standardized e•MMC interface, integrated memory management and extended temperature capability makes it suited to both industrial and consumer designs that require straightforward, durable mass storage.

This device is appropriate for designers seeking a compact, production-ready storage component with on-board ECC and wear management, simplifying system-level design while supporting ongoing production needs within the e•MMC product family.

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