THGBMHG9C4LBAIR

The THGBMHG9C4LBAIR is a non-volatile NAND flash memory device in an e•MMC configuration with an integrated controller and managed memory functions. It provides 512 Gbit capacity organized as 64G x 8 and is supplied in a 153-WFBGA package (11.5 × 13 mm).

Designed for cost-efficient mass storage in applications such as industrial equipment, consumer electronics, multimedia and smart metering/intelligent lighting, this e•MMC device emphasizes standardized interface compatibility, integrated memory management, and extended temperature operation for embedded storage designs.

Key Features

• Memory Core 512 Gbit NAND flash organized as 64G × 8; vendor listing identifies the part at a 64GB density.
• Technology 15 nm MLC NAND flash architecture with integrated controller and managed memory functionality.
• Interface e•MMC interface compliant with JEDEC specifications (vendor materials reference JEDEC Version 5.1); vendor materials note support for high interface speed (HS400 according to JEDEC 5.x).
• Performance Spec Clock frequency listed at 52 MHz in the product specification.
• Memory Management & Reliability Integrated error correction code (ECC), bad block management, wear-leveling and garbage collection as described in vendor materials.
• Power Voltage supply range of 2.7 V to 3.6 V.
• Package & Thermal 153-WFBGA package (11.5 × 13 mm) with operating temperature range of −25 °C to +85 °C.

Typical Applications

• Industrial Equipment Embedded mass storage for control systems and logging where managed NAND and extended temperature operation are required.
• Consumer Electronics Primary or secondary storage in multimedia devices that benefit from an integrated e•MMC controller and standardized interface.
• Multimedia Local content storage for audio/video devices that need reliable NAND management (ECC, wear-leveling, garbage collection).
• Smart Metering & Intelligent Lighting Non-volatile storage for firmware, configuration and data logging in smart infrastructure applications within the specified temperature range.

Unique Advantages

• Integrated Managed Memory: On-device controller with ECC, bad block management, wear-leveling and garbage collection reduces host firmware complexity.
• JEDEC-Based Interface: Conformance to JEDEC e•MMC specifications (vendor materials reference Version 5.1) eases integration with standard e•MMC hosts and software stacks.
• High Interface Capability: Vendor materials note HS400 support according to JEDEC 5.x, providing a pathway to higher interface throughput where supported.
• Compact, Industry Package: 153-WFBGA (11.5 × 13 mm) package provides a small-footprint solution for space-constrained board designs.
• Wide Supply Range: 2.7 V to 3.6 V operation enables compatibility with common embedded power rails.

Why Choose IC FLASH 512GBIT EMMC 153WFBGA?

The THGBMHG9C4LBAIR positions itself as a standardized, managed storage option for embedded designs that require large-capacity NAND with on-board memory management. Its combination of 512 Gbit capacity, integrated controller functions, JEDEC-aligned e•MMC interface, and FBGA packaging supports streamlined design-in for industrial, consumer and multimedia applications.

This part suits designers seeking a balance of capacity, integration and thermal range, with vendor-specified features such as ECC, wear-leveling and HS400 interface capability noted in the product materials to support reliable, sustained storage operation over the product’s specified environment.

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