THGBMJG6C1LBAU7
| Part Description |
IC FLASH 64GBIT EMMC 153FBGA |
|---|---|
| Quantity | 285 Available (as of May 20, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 99 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMJG6C1LBAU7 – 64 Gbit e•MMC™ NAND Flash, 153-WFBGA
The THGBMJG6C1LBAU7 is a non-volatile NAND flash memory device with an e•MMC™ interface, offered as a 64 Gbit (8G × 8) memory organized device. It provides raw flash storage in a compact 153-WFBGA package (11.5 × 13 mm).
Designed for embedded storage implementations that require NAND flash accessed via an e•MMC interface, the device combines a defined memory organization and extended operating temperature range for use in temperature-variable environments.
Key Features
- Memory Technology FLASH - NAND non-volatile memory for persistent data storage.
- Capacity & Organization 64 Gbit capacity organized as 8G × 8, providing a defined memory block structure for system design.
- Interface e•MMC™ memory interface for embedded storage integration.
- Package 153-WFBGA (11.5 × 13 mm) supplier device package suitable for compact board layouts.
- Operating Temperature Rated for −40°C to 105°C (TA), supporting designs that require extended temperature operation.
- Memory Format Provided as FLASH memory format for standard flash storage implementations.
Typical Applications
- Embedded storage systems Provides 64 Gbit e•MMC flash capacity for applications requiring onboard non-volatile storage.
- Compact module designs 153-WFBGA package supports space-constrained PCBs where package footprint is a constraint.
- Temperature-challenged environments Operating range of −40°C to 105°C suits systems that must function across broad ambient conditions.
Unique Advantages
- Defined capacity and organization: 64 Gbit (8G × 8) layout simplifies memory partitioning and capacity planning.
- Standard e•MMC™ interface: Enables integration with host controllers designed for e•MMC memory connectivity.
- Compact WFBGA package: 153-WFBGA (11.5 × 13 mm) reduces board area for space-sensitive designs.
- Extended operating temperature: −40°C to 105°C rating supports deployment in varied thermal environments.
- NAND flash format: FLASH - NAND technology provides non-volatile storage suitable for persistent data retention.
Why Choose IC FLASH 64GBIT EMMC 153FBGA?
The THGBMJG6C1LBAU7 positions itself as a compact, defined-capacity e•MMC NAND flash device for embedded storage applications. Its combination of 64 Gbit capacity, e•MMC interface, and a 153-WFBGA package supports designs that prioritize a small footprint and reliable non-volatile storage.
This device is suited to engineers and procurement teams specifying e•MMC-based memory for systems operating across a wide temperature range who require clear memory organization and a standardized interface for integration.
Request a quote or submit a pricing and availability inquiry to evaluate THGBMJG6C1LBAU7 for your next design.
