THGBMJG8C2LBAIL
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 804 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMJG8C2LBAIL – 256 Gbit e•MMC™ Flash, 153-WFBGA
The THGBMJG8C2LBAIL is a 256 Gbit non-volatile FLASH NAND memory device provided by Kioxia America, Inc., implemented with an e•MMC™ memory interface. It is supplied in a compact 153-WFBGA package (11.5×13).
This device addresses designs that require 256 Gbit of onboard NAND storage with an eMMC interface and supports operation across a temperature range of -25°C to 85°C (TA).
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND memory format providing 256 Gbit of storage.
- Memory Organization Organized as 32G × 8 to present the device capacity and data width.
- Interface eMMC memory interface (e•MMC™ series) for standard embedded memory connectivity.
- Package 153-WFBGA supplier device package, specified as 11.5×13, for compact board-level mounting.
- Operating Temperature Specified ambient operating range of -25°C to 85°C (TA).
- Manufacturer & Identification Part number THGBMJG8C2LBAIL from Kioxia America, Inc.
Typical Applications
- Embedded Storage Board-level non-volatile storage implementations that require an eMMC interface and 256 Gbit capacity.
- High-Capacity Data Retention Systems that need significant onboard NAND storage for local data retention or application storage.
- Space-Constrained Designs Applications where a compact 153-WFBGA package is required for dense PCB layouts.
- Temperature-Scoped Equipment Equipment and devices operating within the specified -25°C to 85°C ambient range that require eMMC storage.
Unique Advantages
- 256 Gbit Storage Capacity: Provides substantial onboard non-volatile storage in a single device.
- Standard eMMC Interface: Simplifies integration into systems designed for eMMC memory connectivity.
- Compact WFBGA Package: 153-WFBGA (11.5×13) package supports compact PCB implementation.
- Defined Memory Organization: 32G × 8 organization aids in system memory planning and addressing.
- Broad Ambient Temperature Range: Rated for -25°C to 85°C (TA) to support a range of operating environments.
- Manufacturer Source: Manufactured by Kioxia America, Inc., identified by part number THGBMJG8C2LBAIL.
Why Choose THGBMJG8C2LBAIL?
THGBMJG8C2LBAIL combines a large 256 Gbit NAND FLASH capacity with an e•MMC™ interface in a compact 153-WFBGA package, providing a straightforward option for designers who need substantial on-board non-volatile storage in space-constrained assemblies. The device’s defined memory organization and specified ambient temperature range (-25°C to 85°C) make it suitable for systems that require clear capacity, package, and environmental parameters.
This part is appropriate for design teams and procurement focused on integrating a high-capacity eMMC memory component while retaining clear, verifiable hardware specifications.
Request a quote or submit a request for pricing and availability for THGBMJG8C2LBAIL to receive current lead time and ordering information.
