THGBMJG8C4LBAU8
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 482 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 99 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGBMJG8C4LBAU8 – IC FLASH 256GBIT eMMC 153FBGA
The THGBMJG8C4LBAU8 is a 256 Gbit non-volatile NAND flash memory device in an e•MMC™ managed-flash form factor. It integrates KIOXIA-managed flash technology and an e-MMC interface to provide a compact, packaged storage solution appropriate for consumer and embedded applications.
Designed for space-constrained designs, this device offers a 32G × 8 memory organization in a 153-ball WFBGA (11.5 × 13 mm) package and supports a wide operating temperature range, enabling deployment across a range of mobile and consumer electronics use cases.
Key Features
- Memory Type & Technology Non-volatile FLASH (NAND) memory delivering 256 Gbit capacity as a managed e-MMC device.
- Memory Organization Organized as 32G × 8 to match common system memory mapping requirements.
- Managed e-MMC Architecture e•MMC managed flash solution that integrates KIOXIA controller functionality with flash memory in a single package.
- Package 153-WFBGA (153-ball WFBGA) package, 11.5 × 13 mm footprint for compact board-level integration.
- Operating Temperature Specified for −40°C to 105°C (TA), suitable for extended-temperature consumer and embedded environments.
- Standards & Technology e-MMC managed-flash offering aligned with e-MMC key features including BiCS FLASH™ 3D flash memory (per product datasheet) and JEDEC-standard implementation.
Typical Applications
- Smartphones On-board user and system storage for mobile devices where compact, managed flash is required.
- AR/VR Local storage for content and system data in augmented and virtual reality platforms.
- Tablets and 2‑in‑1 Devices Integrated storage for application and multimedia content in portable computing devices.
- Streaming Media and Smart Speakers Local media caching and firmware storage for consumer streaming and smart audio products.
Unique Advantages
- Managed, single-package storage: Integrates flash memory and controller functionality to simplify system-level storage integration.
- High density in a compact footprint: 256 Gbit capacity in a 153-WFBGA (11.5 × 13 mm) package reduces board area for high-capacity designs.
- Wide operating temperature: −40°C to 105°C rating supports deployment in extended-temperature embedded and consumer environments.
- Industry-standard interface: e-MMC interface and JEDEC-standard characteristics facilitate adoption with compatible SoCs.
- 3D NAND technology (BiCS FLASH™): Utilizes BiCS FLASH™ 3D flash memory technology (as cited in product documentation) for scalable density.
Why Choose IC FLASH 256GBIT EMMC 153FBGA?
The THGBMJG8C4LBAU8 positions as a compact, managed e-MMC storage option delivering 256 Gbit density with integrated controller functionality from KIOXIA. Its combination of high capacity, 153-WFBGA packaging, and broad −40°C to 105°C operating range makes it suitable for space-constrained consumer and embedded designs that require packaged flash storage.
This device is appropriate for designers seeking a standardized e-MMC managed-flash solution with 3D BiCS NAND technology and a compact board-level footprint, enabling straightforward integration into mobile, AR/VR, tablet, and media-centric products.
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