THGBMHG8C2LBAIL

The THGBMHG8C2LBAIL is a 256 Gbit non-volatile NAND flash memory in an e•MMC format, combining NAND flash and an integrated controller with enhanced memory management. It is built for applications that require cost-effective, managed mass storage and conforms to JEDEC e•MMC standards.

Designed for embedded and industrial markets, this device delivers managed storage functionality with on-die error correction and memory management features to simplify host integration and system design.

Key Features

• Memory  256 Gbit capacity organized as 32G × 8, providing high-density non-volatile storage in a single package.
• Technology  NAND FLASH memory using 15 nm MLC process technology as specified in the product family documentation.
• Interface & Standards  e•MMC interface with JEDEC Version 5.1 compliance (e•MMC family standard), offering a standardized managed-memory interface for host systems.
• Integrated Memory Management  On-chip controller with error correction code (ECC), bad block management, wear-leveling and garbage collection to maintain data integrity and simplify host software.
• Performance  Designed for high interface speed modes (HS400 per JEDEC 5.x as noted in the product family) and documented clock frequency of 52 MHz.
• Power  Single supply operation across 2.7 V to 3.6 V.
• Package & Temperature  153-WFBGA package (11.5 × 13 mm) with an operating temperature range of –25 °C to +85 °C.

Typical Applications

• Industrial  High-density, non-volatile storage for embedded controllers and data logging where managed flash reduces host-side design complexity.
• Consumer Electronics  Local storage for multimedia assets and system firmware in consumer devices that require standardized, removable-free storage.
• Multimedia  Storage for audio/video content and application data where capacity and managed reliability are required.
• Smart Metering & Intelligent Lighting  Reliable onboard storage for measurement data and configuration in networked field devices operating within the specified temperature range.

Unique Advantages

• Managed Storage Solution: Integrated controller and e•MMC interface offload flash management from the host, simplifying firmware and driver requirements.
• Standards Compliance: JEDEC e•MMC compliance (version 5.x family) enables easier system integration and interoperability with host controllers that support e•MMC.
• Data Integrity Features: Built-in ECC, bad block management, wear-leveling and garbage collection help maintain long-term data reliability.
• High Density in Compact Package: 256 Gbit capacity in a 153-WFBGA (11.5 × 13 mm) package saves board space while providing significant local storage.
• Wide Supply Range: 2.7 V to 3.6 V operation supports common embedded system power rails.
• Temperature Range for Embedded Use: Rated for –25 °C to +85 °C to support industrial and consumer-grade environments.

Why Choose IC FLASH 256GBIT EMMC 153WFBGA?

The THGBMHG8C2LBAIL positions itself as a compact, standards-based managed storage option for designs that need substantial local NAND capacity without adding host-side flash management complexity. Its integrated controller and on-die management features simplify integration and support reliable data retention across typical embedded temperature ranges.

This device is suited to designers and procurement teams seeking a high-density e•MMC module for industrial, consumer or multimedia applications where JEDEC compliance, integrated memory management and a compact WFBGA package enable predictable system-level behavior and streamlined BOMs.

Request a quote or submit an inquiry to start the procurement process for THGBMHG8C2LBAIL and evaluate its fit for your storage requirements.