THGAMVG9T23BAIL

The THGAMVG9T23BAIL is a managed e‑MMC flash memory device integrating KIOXIA flash and an e‑MMC controller in a single 153‑ball BGA package. It provides 512 Gbit (64 GB) of non‑volatile NAND storage organized as 64G × 8 and implements managed‑flash functions such as error correction, wear leveling, logical‑to‑physical address translation, and bad‑block management.

Designed for embedded applications where a compact, integrated storage solution is required, the device supports the e‑MMC interface (JEDEC v5.0/v5.1) and is suitable for IoT devices, consumer electronics, mobile and streaming applications that need embedded managed NAND with on‑board controller functionality.

Key Features

• Integrated e‑MMC Managed Flash KIOXIA controller combined with NAND flash delivers managed‑flash features including ECC, wear leveling and bad‑block management, reducing host overhead.
• Memory Capacity & Organization 512 Gbit total capacity organized as 64G × 8, providing a compact embedded storage option.
• e‑MMC Interface (JEDEC v5.0 / v5.1) Compliant with e‑MMC standards and designed for systems using the MultiMediaCard/MMC interface; the e‑MMC v5.1 specification supports up to 400 MB/s as noted in the product brief.
• Flash Technology Implements KIOXIA BiCS FLASH™ 3D NAND or 15 nm process technology options as described in the product brief for managed e‑MMC products.
• Clock & Performance Interface clock frequency specified at 200 MHz for timing reference in host implementations.
• Power Supply Single‑supply operation over 2.7 V to 3.6 V (VCC range listed in specifications).
• Package & Footprint 153‑ball BGA package with a supplier device package dimension of 11.5 × 13 mm, enabling a small board footprint for embedded designs.
• Operating Temperature Specified operating range of –20°C to 85°C (TC) for standard temperature applications.

Typical Applications

• IoT Devices — Embedded storage for firmware, logging and local data retention in compact connected devices.
• Smartphones & Tablets — Onboard managed NAND for system storage where e‑MMC interface support is required.
• Smart TVs & Streaming Media — Local content storage and system image storage in consumer electronics.
• Smart Speakers — Persistent storage for audio assets, configuration and software images.
• Automotive — Listed as an application in the product brief for embedded storage use; note that no AEC qualification is specified in the product data.

Unique Advantages

• Managed, Integrated Solution: Combines flash memory and controller in one device to offload error management and address translation from the host.
• Standards Compliance: JEDEC e‑MMC v5.0/v5.1 compatibility simplifies integration with SoCs and platforms that support the MMC interface.
• Compact Package: 153‑ball BGA (11.5 × 13 mm) minimizes PCB area for space‑constrained designs.
• On‑board Reliability Features: Built‑in ECC, wear leveling and bad‑block management improve data integrity and endurance without additional host firmware.
• Wide Supply and Temperature Range: Operates from 2.7 V to 3.6 V and across –20°C to 85°C to accommodate typical embedded operating environments.
• Multiple Boot Partitions: Boot partition support noted in the product brief to assist system boot strategies.

Why Choose THGAMVG9T23BAIL?

THGAMVG9T23BAIL positions as a compact, managed e‑MMC storage solution that combines KIOXIA NAND and controller technology to simplify host design and system integration. Its e‑MMC v5.x compliance, on‑board ECC and wear‑leveling make it suitable for embedded systems that require reliable non‑volatile storage with minimal host management.

This device is aimed at designs where a standardized MMC interface, small package footprint and integrated flash management reduce BOM complexity and accelerate time to market. Its specification set supports deployments across a range of consumer and embedded product categories where managed NAND is preferred.

Request a quote or contact sales to discuss availability, lead times and volume pricing for THGAMVG9T23BAIL.