THGAMRG8T13BAIL

IC FLASH 256GBIT EMMC 153FBGA
Part Description

IC FLASH 256GBIT EMMC 153FBGA

Quantity 594 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKioxia America, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of THGAMRG8T13BAIL – IC FLASH 256GBIT EMMC 153FBGA

The THGAMRG8T13BAIL is a 256 Gbit non-volatile NAND flash memory device in the Kioxia America, Inc. e•MMC™ series. It implements a 32G × 8 memory organization and provides embedded multi-media card (eMMC) interface connectivity in a compact 153-WFBGA package.

This device is intended for designs that require onboard non-volatile storage with a defined operating temperature range and a standard eMMC interface. Key value propositions include large raw capacity, industry-standard eMMC connectivity, and a compact WFBGA package footprint.

Key Features

  • Memory Core 256 Gbit NAND flash memory organized as 32G × 8, providing raw storage capacity in a single device.
  • Memory Technology FLASH - NAND non-volatile memory format for persistent data storage.
  • Interface eMMC memory interface (e•MMC™ series) for embedded storage integration.
  • Voltage Supply Operates from 2.7 V to 3.6 V, enabling compatibility with common system power rails.
  • Package 153-WFBGA package (11.5 × 13 mm) designed for surface-mount assembly in space-constrained systems.
  • Operating Temperature Specified for −25°C to 85°C (TA), supporting a range of ambient environments.
  • Mounting / Format Surface-mount WFBGA device supplied as non-volatile flash memory for direct PCB integration.

Typical Applications

  • Embedded storage systems — Used where onboard non-volatile storage is required and an eMMC interface is preferred for system integration.
  • Consumer electronic devices — Provides high capacity flash memory in a compact WFBGA package for space-limited designs.
  • Industrial equipment — Supports systems operating within the specified −25°C to 85°C ambient range that require persistent NAND flash storage.

Unique Advantages

  • High raw capacity: 256 Gbit of NAND flash enables consolidation of storage needs into a single component.
  • Standard eMMC interface: Simplifies integration into designs that support embedded MMC connectivity.
  • Compact WFBGA package: 153-ball WFBGA (11.5 × 13 mm) minimizes board area for high-density applications.
  • Wide supply voltage range: 2.7 V to 3.6 V operation aligns with common system power rails for flexible deployment.
  • Extended ambient operating range: Specified operation from −25°C to 85°C for use in a variety of environments.

Why Choose IC FLASH 256GBIT EMMC 153FBGA?

The THGAMRG8T13BAIL provides a straightforward, high-capacity eMMC flash solution from Kioxia America, Inc. Its 256 Gbit NAND array, eMMC interface, and compact 153-WFBGA package make it suitable for designs that require significant onboard non-volatile storage in a small form factor. The device’s voltage and temperature specifications help ensure compatibility with systems that operate within the stated ranges.

This product is well suited to engineers and procurement teams specifying embedded storage components where capacity, standard eMMC connectivity, and a WFBGA package footprint are key selection criteria.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information for the THGAMRG8T13BAIL.

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