THGAF8T1T83BAIR

The THGAF8T1T83BAIR is a managed flash memory device combining KIOXIA flash and controller technology in a Universal Flash Storage (UFS) format. It provides 256 Gbit of NAND flash organized as 32G x 8 and uses a serial UFS interface for managed storage.

Designed for consumer-oriented mobile and embedded markets, this part targets applications that require high-density, managed non-volatile memory in a compact 153‑VFBGA package with a supply range of 2.7 V to 3.6 V and an operating temperature of -25°C to 85°C.

Key Features

• Memory Technology 256 Gbit BiCS FLASH™ 3D NAND managed with a KIOXIA controller, provided as a single-package managed flash solution.
• Memory Organization Organized as 32G × 8 to present the 256 Gbit capacity in a compact format.
• Interface Universal Flash Storage (UFS) serial interface for managed flash operation as described in the product family documentation.
• Power Operates from a 2.7 V to 3.6 V supply range to support common consumer supply rails.
• Package 153‑VFBGA (11.5 × 13 mm) 153-ball BGA package to minimize board area while integrating flash and controller.
• Temperature Range Consumer temperature class: -25°C to 85°C (TC) for typical consumer applications.
• Standards Implemented as a JEDEC-standard managed flash UFS product within the KIOXIA UFS product family.
• Performance Orientation Described in product literature as targeted for high-speed reads/writes and low pin count interface implementations.

Typical Applications

• Smartphones Provides high-density managed flash storage suitable for mobile device storage requirements.
• AR/VR Compact UFS storage option for consumer AR/VR devices where integrated managed storage is required.
• Tablets and 2‑in‑1 devices Supports higher-density local storage needs in portable computing devices.
• Streaming media and smart audio Managed flash storage for consumer streaming media players and smart speaker platforms that require local content or firmware storage.

Unique Advantages

• Integrated managed solution: Combines KIOXIA flash with a controller in a single UFS package to simplify system-level storage integration.
• High-density option: 256 Gbit capacity fits designs that require sizable local non-volatile storage without external memory devices.
• Compact BGA package: 153‑VFBGA (11.5 × 13 mm) minimizes PCB footprint for space-constrained consumer products.
• JEDEC-standard UFS family: Part of a documented UFS product lineup spanning multiple densities for design scalability.
• Wide supply range: 2.7 V to 3.6 V operation aligns with common consumer power rails for straightforward integration.
• Consumer temperature range: -25°C to 85°C supports typical consumer electronics thermal requirements.

Why Choose IC FLASH 256GBIT UFS 153VFBGA?

The THGAF8T1T83BAIR places KIOXIA-managed UFS storage into a compact 153‑VFBGA package, offering 256 Gbit capacity and a UFS serial interface suitable for consumer mobile and embedded devices. Its integrated controller-plus-flash approach simplifies board-level design while providing the density needed for modern content and application storage.

This device is appropriate for designers seeking scalable, high-density managed flash from a documented UFS product family (32 GB to 512 GB options are defined in the product literature), enabling consistent integration choices across device generations.

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